HSMS-286C-TR1 Avago Technologies US Inc., HSMS-286C-TR1 Datasheet - Page 13

• Manufacturer Part Number: HSMS-286C-TR1
• Description: DETECTOR DIODE,SOT-323
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-286C-TR1

• Rohs Compliant: NO
• Diode Type: Schottky - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 4V
• Capacitance @ Vr, F: 0.25pF @ 0V, 1MHz
• Package / Case: SC-70-3, SOT-323-3
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Max: -
• Power Dissipation (max): -
• Resistance @ If, F: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 33
(dimensions are in inches).
Figure 33. PCB Pad Layout
(dimensions in inches).
A recommended PCB pad layout
for the miniature SOT-363 (SC-70
6 lead) package is shown in
Figure 34 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assem-
bly equipment without adding
parasitics that could impair the
performance.
Figure 34. PCB Pad Layout
(dimensions in inches).
0.035
0.035
0.026
0.026
0.016
0.016
0.07
0.075
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
packages, will reach solder
reflow temperatures faster than
those with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 35. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
Figure 35. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evapo-
rating solvents from the solder
paste. The reflow zone briefly
elevates the temperature suffi-
ciently to produce a reflow of the
solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures
and times necessary to achieve a
uniform reflow of solder.
Reflow
Zone
13
180
Cool Down
Zone
MAX
) should not
240
T
MAX
300