HSMS-2825-TR1 Avago Technologies US Inc., HSMS-2825-TR1 Datasheet - Page 9

• Manufacturer Part Number: HSMS-2825-TR1
• Description: Diode
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-2825-TR1

• Series Resistance @ If: 12ohm
• Peak Reflow Compatible (260 C): No
• Reel Quantity: 3000
• Pin Configuration: Unconnected Pair
• Breakdown Voltage Min: 15V
• Leaded Process Compatible: No
• Forward Voltage: 340mV
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Assembly Instructions
SOT-3x3 PCB Footprint
Recommended PCB pad layouts
for the miniature SOT-3x3 (SC-70)
packages are shown in Figures 26
and 27 (dimensions are in inches).
These layouts provide ample
allowance for package placement
by automated assembly equipment
without adding parasitics that
could impair the performance.
Figure 26. Recommended PCB Pad
Layout for Agilent’s SC70 3L/SOT-323
Products.
Figure 27. Recommended PCB Pad
Layout for Agilent's SC70 6L/SOT-363
Products.
0.039
0.039
0.026
0.026
Dimensions in inches
Dimensions in inches
0.018
0.022
0.079
0.079
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
packages, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 28. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
Figure 28. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
Reflow
Zone
10
180
Cool Down
Zone
MAX
) should not
240
T
MAX
300