BLF6G10LS-200RN:11 NXP Semiconductors, BLF6G10LS-200RN:11 Datasheet - Page 3

BLF6G10LS-200RN/LDMOST/TUBE-BU

BLF6G10LS-200RN:11

Manufacturer Part Number
BLF6G10LS-200RN:11
Description
BLF6G10LS-200RN/LDMOST/TUBE-BU
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G10LS-200RN:11

Transistor Type
LDMOS
Frequency
871.5MHz
Gain
20dB
Voltage - Rated
65V
Current Rating
49A
Current - Test
1.4A
Voltage - Test
28V
Power - Output
40W
Package / Case
SOT502B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934063255112
NXP Semiconductors
5. Thermal characteristics
6. Characteristics
7. Application information
BLF6G10-200RN_10LS-200RN_2
Product data sheet
7.1 Ruggedness in class-AB operation
Table 5.
Table 6.
T
Table 7.
Mode of operation: 2-carrier W-CDMA; PAR 7.5 dB at 0.01 % probability on CCDF; 3GPP test
model 1; 1-64 PDPCH; f
RF performance at V
class-AB production test circuit.
The BLF6G10-200RN and BLF6G10LS-200RN are enhanced rugged devices and are
capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all
phases under the following conditions: V
f = 894 MHz.
Symbol
R
Symbol Parameter
V
V
V
I
I
I
g
R
C
Symbol
P
G
IRL
ACPR
η
DSS
DSX
GSS
j
fs
D
(BR)DSS
GS(th)
GSq
L(AV)
th(j-case)
DS(on)
rs
p
= 25
°
C unless otherwise specified.
drain-source breakdown
voltage
gate-source threshold voltage
gate-source quiescent voltage V
drain leakage current
drain cut-off current
gate leakage current
forward transconductance
drain-source on-state
resistance
feedback capacitance
Parameter
average output power
power gain
input return loss
drain efficiency
adjacent channel power ratio
Thermal characteristics
Characteristics
Application information
Parameter
thermal resistance from
junction to case
DS
= 28 V; I
1
Rev. 02 — 21 January 2010
= 871.5 MHz; f
Dq
= 1400 mA; T
Conditions
T
P
2
case
L
= 876.5 MHz; f
Conditions
V
V
I
V
V
V
V
V
V
I
V
f = 1 MHz
= 40 W
D
D
GS
DS
DS
GS
GS
DS
GS
DS
GS
GS
DS
= 1620 mA
= 9.45 A
= 80 °C;
= 0 V; I
= 10 V; I
= 28 V;
= 0 V; V
= V
= 10 V
= 11 V; V
= 10 V; I
= V
= 0 V; V
= 28 V; I
case
BLF6G10(LS)-200RN
GS(th)
GS(th)
P
Conditions
P
P
P
= 25
L(AV)
L(AV)
L(AV)
L(AV)
D
DS
DS
D
D
= 0.9 mA
+ 3.75 V;
DS
+ 3.75 V;
3
Dq
= 270 mA
= 9.45 A
= 40 W
= 40 W
= 40 W
= 40 W
°
= 886.5 MHz; f
Type
BLF6G10-200RN
BLF6G10LS-200RN
= 28 V
= 28 V;
C; unless otherwise specified; in a
= 0 V
= 1400 mA; P
Power LDMOS transistor
Min
-
19
-
25
-
Min
65
1.4
1.7
-
40
-
11
0.012 0.07
-
4
= 891.5 MHz;
L
= 200 W;
Typ
40
20
−6.4
28.5
−39.4 −36
Typ
-
2.0
2.2
-
48
-
18
3
© NXP B.V. 2010. All rights reserved.
Typ
0.50
0.35
-
-
Max
-
2.4
2.7
4.2
-
420
26
0.093 Ω
-
Max
-
−4.5
Unit
K/W
K/W
3 of 11
Unit
W
dB
dB
%
dBc
Unit
V
V
V
μA
A
nA
S
pF

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