NUP1301 NXP Semiconductors, NUP1301 Datasheet

DIODE,DUAL TVS,UNI DIR,220W,80V,SOT23

NUP1301

Manufacturer Part Number
NUP1301
Description
DIODE,DUAL TVS,UNI DIR,220W,80V,SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NUP1301

Reverse Stand-off Voltage Vrwm
80V
Breakdown Voltage Range
100V
Clamping Voltage Vc Max
20V
Diode Configuration
Unidirectional
Peak Pulse Current Ippm
11A
Diode Case Style
SOT-23
No. Of
RoHS Compliant

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1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small
SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to
protect one signal line in rail-to-rail configuration from the damage caused by ESD
and other transients.
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Table 1.
T
Symbol
Per diode
V
C
I
R
amb
RRM
d
NUP1301
Ultra low capacitance ESD protection array
Rev. 01 — 11 May 2009
ESD protection of one signal line (rail-to-rail configuration)
Ultra low diode capacitance: C
Very low reverse leakage current:
ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); I
AEC-Q101 qualified
Telecommunication networks
Video line protection
Microcontroller protection
I
Antenna power supply
Analog audio
Class-D amplifier
2
= 25 C unless otherwise specified.
C-bus protection
Quick reference data
Parameter
repetitive peak reverse
voltage
diode capacitance
reverse current
PP
= 11 A at t
d
= 0.6 pF
Conditions
f = 1 MHz;
V
V
R
R
30 nA
= 0 V
= 80 V
p
= 8/20 s
Min
-
-
-
Typ
-
0.6
-
Product data sheet
Max
80
0.75
100
Unit
V
pF
nA

Related parts for NUP1301

NUP1301 Summary of contents

Page 1

... NUP1301 Ultra low capacitance ESD protection array Rev. 01 — 11 May 2009 1. Product profile 1.1 General description Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect one signal line in rail-to-rail configuration from the damage caused by ESD and other transients ...

Page 2

... Marking Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current repetitive peak forward t 1 ms; p current Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array Simplified outline Graphic symbol [1] Marking code LJ* Min Max - 80 - ...

Page 3

... ESD maximum ratings Parameter Conditions electrostatic discharge IEC 61000-4-2 voltage (contact discharge) machine model MIL-STD-883 (human body model) ESD standards compliance Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array Min Max [ 0.5 [3][4] - 220 [3][4] - ...

Page 4

... Product data sheet 001aaa630 Fig 2. Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array I PP 100 % 0 ESD pulse waveform according to IEC 61000-4-2 Conditions Min Typ ...

Page 5

... 150 mA F reverse current 150 150 C j diode capacitance MHz; V clamping voltage 300 s; 0.02. p Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array Min Typ 100 - [ 0.6 R [2][ [2][ © NXP B.V. 2009. All rights reserved. Max Unit - V 715 mV 855 ...

Page 6

... Based on square wave currents prior to surge j Non-repetitive peak forward current as a function of pulse duration; typical values 0 (pF ) 0.6 0.4 0 MHz amb Diode capacitance as a function of reverse voltage; typical values NUP1301 mbg704 mbg446 (V) R © NXP B.V. 2009. All rights reserved ...

Page 7

... ESD pulse waveform (IEC 61000-4-2 network), pin and 2 vertical scale = 10 A/div horizontal scale = 15 ns/div GND clamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) , pin and 2 Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array 4 GHz DIGITAL OSCILLOSCOPE 10 ATTENUATOR 50 vertical scale = 10 V/div ...

Page 8

... Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the NUP1301 as close to the input terminal or connector as possible. 2. The path length between the NUP1301 and the protected line should be minimized. ...

Page 9

... Dimensions in mm Package outline SOT23 (TO-236AB) Packing methods Package Description SOT23 4 mm pitch tape and reel Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array 1.1 0.9 3 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 [1] ...

Page 10

... Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array 2 0 Dimensions in mm Dimensions in mm preferred transport direction during soldering © NXP B.V. 2009. All rights reserved. solder lands solder resist solder paste occupied area ...

Page 11

... Revision history Table 11. Revision history Document ID Release date NUP1301_1 20090511 NUP1301_1 Product data sheet Ultra low capacitance ESD protection array Data sheet status Change notice Product data sheet - Rev. 01 — 11 May 2009 NUP1301 Supersedes - © NXP B.V. 2009. All rights reserved ...

Page 12

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array © NXP B.V. 2009. All rights reserved ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NUP1301 All rights reserved. Date of release: 11 May 2009 Document identifier: NUP1301_1 ...

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