45593-1600 Molex Inc, 45593-1600 Datasheet - Page 10
![CONN PLUG 16POS .8MM VERT PCB](/photos/3/22/32274/45593-1600_sml.jpg)
45593-1600
Manufacturer Part Number
45593-1600
Description
CONN PLUG 16POS .8MM VERT PCB
Manufacturer
Molex Inc
Series
HandyLink™ 45593r
Specifications of 45593-1600
Connector Style
Plug
Connector Type
Handylink
Number Of Positions
16
Mounting Type
Through Hole
Termination
Solder
Contact Finish
Gold
Color
Black
Housing Material
Thermoplastic, High Temperature
Insulation Resistance
1000 M Ohms
Mounting Angle
Vertical
Operating Temperature Range
- 40 C to + 85 C
Number Of Positions / Contacts
16
Pitch
0.8 mm
Contact Plating
Gold, Tin
Contact Material
High Performance Alloy (HPA)
Gender
Male
Current Rating
1.5 A
Mounting Style
Through Hole
Termination Style
Solder
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Finish Thickness
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
045593-1600
045593-1600-E
0455931600
0455931600-E
45593-1600-E
455931600
455931600-E
WM17126
045593-1600-E
0455931600
0455931600-E
45593-1600-E
455931600
455931600-E
WM17126
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
REVISION:
DOCUMENT NUMBER:
A
6.2
Ingress protection, as described by IEC 60529, is a function of the customer’s enclosure. The
HandyLink™ Receptacle Connector has been designed to facilitate enclosure design when
ingress protection is required. The interfaces between the metal and plastic components of the
connector are sealed to discourage intrusion of dust and liquid through the connector into the
enclosure. The customer is expected to design an appropriate seal around the periphery of the
connector to adequately seal the finished enclosure. Contact Molex for additional information.
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
Ingress Protection
Figure 4. Sealing to achieve ingress protection with the receptacle connector
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
The bottom surface, once soldered, forms a
continuous seal with the PCB
Gaskets may be applied to the top and
sides, or front surfaces.
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
SHEET No.
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