44828-1162 Molex Inc, 44828-1162 Datasheet - Page 6
44828-1162
Manufacturer Part Number
44828-1162
Description
CONN RCPT 16POS .8MM RT/ANG SMD
Manufacturer
Molex Inc
Series
HandyLink™ 44828r
Specifications of 44828-1162
Connector Style
Receptacle
Connector Type
Handylink
Number Of Positions
16
Mounting Type
Surface Mount, Right Angle
Termination
Solder
Contact Finish
Gold
Color
Black
Housing Material
Thermoplastic, High Temperature
Insulation Resistance
1000 M Ohms
Mounting Angle
Right
Operating Temperature Range
- 40 C to + 85 C
Number Of Positions / Contacts
16
Pitch
0.8 mm
Contact Plating
Gold
Contact Material
High Performance Alloy (HPA)
Gender
Female
Current Rating
1.5 A
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Finish Thickness
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
044828-1162
044828-1162-C
0448281162
0448281162-C
44828-1162-C
448281162
448281162-C
WM17127TR
044828-1162-C
0448281162
0448281162-C
44828-1162-C
448281162
448281162-C
WM17127TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
44828-1162
Manufacturer:
AD
Quantity:
560
Company:
Part Number:
44828-1162
Manufacturer:
MOLEX
Quantity:
44 014
REVISION:
DOCUMENT NUMBER:
5.0 SOLDERING PROCESS RECOMMENDATIONS
A
5.1
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout.
Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found in Product Specification PS-44828-001.
The profiles are provided for reference purposes only.
5.1.4 Inspection
Solder joints should be inspected using established conventional methods.
5.2
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts.
Contact Molex if further assistance is required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
5.2.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found
The profiles are provided for reference purposes only.
5.2.4 Inspection
Solder joints should be inspected using established conventional methods.
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
44828 SMT Receptacle Connector
45560 SMT Cradle Connector
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
in
Product Specification PS-44828-001.
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
SHEET No.
6
of
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