44828-1162 Molex Inc, 44828-1162 Datasheet - Page 2

• Manufacturer Part Number: 44828-1162
• Description: CONN RCPT 16POS .8MM RT/ANG SMD
• Manufacturer: Molex Inc
• Series: HandyLink™ 44828r

Specifications of 44828-1162

• Connector Style: Receptacle
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Surface Mount, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Thermoplastic, High Temperature
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Right
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold
• Contact Material: High Performance Alloy (HPA)
• Gender: Female
• Current Rating: 1.5 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 044828-1162; 044828-1162-C; 0448281162; 0448281162-C; 44828-1162-C; 448281162; 448281162-C; WM17127TR

REVISION:
DOCUMENT NUMBER:
A
Section
1.0
2.0
3.0
4.0
5.0
6.0
7.0
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
Scope
Product Description
Applicable Documents and Specifications
Mating and Un-Mating of Connectors
Soldering Process Recommendations
Mechanical Design Recommendations
Electrical Recommendations
4.1 Recommendations for Mating and Un-Mating
4.2 Mating Alignment Tolerances
5.1 44828 SMT Receptacle Connector
5.2 45560 SMT Cradle Connector
5.3 45339 Plug Module for Wire Termination
5.4 45593 Plug Module for PCB Termination
6.1 Mechanical Fasteners and Support
6.2 Ingress Protection
6.3 Plug Cable Over-Molding
6.4 Design Best Practices
7.1 Power Considerations
7.2 High Speed Signal Transmission
UCP2004-2588
6/24/04
5.1.1 PCB Layout
5.1.2 Solder Paste Stencil Layout
5.1.3 Reflow Profile
5.1.4 Inspection
5.2.1 PCB Layout
5.2.2 Solder Paste Stencil Layout
5.2.3 Reflow Profile
5.2.4 Inspection
5.3.1 Applicable Wire Sizes
5.3.2 Wire Preparation
5.3.3 Inspection
5.4.1 PCB Layout
5.4.2 Inspection
6.1.1 Receptacle Connector
6.1.2 Plug Connector Modules
6.1.3 Cradle Connector
6.3.1 Wire Soldering
6.3.2 Encapsulation
6.3.3 Strain Relief
6.3.4 Final Over-Molding
6.4.1 Plug Over-mold Designs
6.4.2 Cradle Designs
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
Table of Contents
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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APPROVED BY:
Joe Comerci
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