78001-1244 Molex Inc, 78001-1244 Datasheet - Page 4

• Manufacturer Part Number: 78001-1244
• Description: CONN SOCKET MINIDIMM REV R/A SMD
• Manufacturer: Molex Inc
• Series: 78001r

Specifications of 78001-1244

• Connector Style: MiniDIMM
• Number Of Positions: 244
• Memory Type: DDR 2 SDRAM
• Standards: MO-244
• Mounting Type: Surface Mount, Right Angle
• Features: Board Guide, Latches
• Mounting Feature: Reverse
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Pitch: 0.6 mm
• Number Of Positions / Contacts: 244
• Mounting Style: SMD/SMT
• Mounting Angle: Right
• Housing Material: Thermoplastic, High Temperature
• Contact Material: Brass, Phosphor Bronze
• Contact Plating: Gold
• Voltage Rating: 30 V
• Current Rating: 1 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 078001-1244; 078001-1244-E; 0780011244; 0780011244-E; 78001-1244-E; 780011244; 780011244-E; WM23940

REVISION: ECR/ECN INFORMATION:
DOCUMENT NUMBER:
B
5.3 ENVIRONMENTAL REQUIREMENTS
ITEM
13
14
15
16
17
18
19
PS-78001-001
EC No:
DATE:
Temperature &
Soldering Heat
Thermal Aging
DESCRIPTION
Resistance to
Solderability
Resistance
(Thermal)
Humidity
Porosity
Solvent
Shock
Cyclic
Test
S2007-1019
2007/05/17
PRODUCT SPECIFICATION
Preconditioning to be done at 105°C for 72 hrs
42 parts DI water by volume, 1 part of
propylene glycol monomethyl ether
Per EIA-364-17
Solder time: 5±0.5 seconds.
Solder temperature: 260±5°C
Subject to steam aging for 8 hours ± 5 mins.
Nitric Acid Test, 10 contacts per contact type
selected at random.
Per EIA 364-53
(Glycolether PM, 1 methoxy-2-propanol). 1
part by volume of monoethanolamine.
MIL – STD – 202F Method 215J.
Unmated, exposed to reflow profile as defined
in Section 8.1.
TEST CONDITION
Mate connectors; expose to 5 cycles of:
Temperature °C
EIA-364-32-Test condition l
Mate connectors and expose to 500 hours at
105 ± 2°C.
Mate connectors and expose for 10 days at
25°C to 65°C at 90-98% RH.
Per EIA-364-31, Method III.
+25 +10/-5
+85 +3/-0
+25 +10/-5
-55 +0/-3
TITLE:
CREATED / REVISED BY:
CM TEO 2007/05/17
Reverse Right Angle Mini DIMM, SMT
30
30
Duration (Minutes)
200/244Ckt, 0.60mm Pitch
5 MAXIMUM
5 MAXIMUM
YT YANG 2007/05/25
Connector
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
No change in LLCR greater
than 10 mΩ from initial.
No change in LLCR greater
than 10 mΩ from initial.
No change in LLCR greater
than 10 mΩ from initial.
Solder coverage:
95% minimum
Maximum number of pores :
30uin-1 pore per 10 contacts
No Damage or discoloration
of connector materials or
marking.
No Damage or blistering.
REQUIREMENT
SH LENI 2007/05/25
APPROVED BY:
SHEET No.
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