78001-1244 Molex Inc, 78001-1244 Datasheet

CONN SOCKET MINIDIMM REV R/A SMD

78001-1244

Manufacturer Part Number
78001-1244
Description
CONN SOCKET MINIDIMM REV R/A SMD
Manufacturer
Molex Inc
Series
78001r
Datasheets

Specifications of 78001-1244

Connector Style
MiniDIMM
Number Of Positions
244
Memory Type
DDR 2 SDRAM
Standards
MO-244
Mounting Type
Surface Mount, Right Angle
Features
Board Guide, Latches
Mounting Feature
Reverse
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Pitch
0.6 mm
Number Of Positions / Contacts
244
Mounting Style
SMD/SMT
Mounting Angle
Right
Housing Material
Thermoplastic, High Temperature
Contact Material
Brass, Phosphor Bronze
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
1 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
078001-1244
078001-1244-E
0780011244
0780011244-E
78001-1244-E
780011244
780011244-E
WM23940

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
78001-1244
Manufacturer:
MOLEX
Quantity:
34 760
REVISION: ECR/ECN INFORMATION:
DOCUMENT NUMBER:
1.0 SCOPE
2.0 PRODUCT DESCRIPTION
B
This Product Specification covers the performance requirements of the 0.60 mm centerline edge
card socket for board to board interconnect of 1.00 mm thick memory modules.
2.1 PRODUCT NAME AND SERIES NUMBER (S)
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
2.3 SAFETY AGENCY APPROVALS
PS-78001-001
Series Number
78001
See the appropriate Sales Drawings for information on dimensions, materials, plating and
markings, recommended module outlines and footprint Specifications.
EC No:
DATE:
Reverse Right Angle Mini DIMM, 200 / 244 Ckt 0.60mm pitch SMT
S2007-1019
2007/05/17
UL File
CSA File
PRODUCT SPECIFICATION
:
:
TITLE:
CREATED / REVISED BY:
CM TEO 2007/05/17
E29179
1699020 (LR 19980)
Product Descriptions
200/244 Ckt Reverse Right Angle Mini DIMM
Reverse Right Angle Mini DIMM, SMT
200/244Ckt, 0.60mm Pitch
YT YANG 2007/05/25
Connector
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
SH LENI 2007/05/25
APPROVED BY:
SHEET No.
1
of
6

Related parts for 78001-1244

78001-1244 Summary of contents

Page 1

... Specifications. 2.3 SAFETY AGENCY APPROVALS UL File CSA File REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Product Descriptions 200/244 Ckt Reverse Right Angle Mini DIMM : E29179 : 1699020 (LR 19980) TITLE: Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch ...

Page 2

... Withstanding Voltage REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 TEST CONDITION Mate connectors: apply a maximum voltage and a current of 100 mA. EIA-364-23 Temperature of mater connector at rated current for 96 hours (6 consecutive ckts link in series) Unmate & unmount connectors: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground ...

Page 3

... REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 TEST CONDITION Amplitude : 1.52mm peak to peak Sweep : 10-55- one min. Duration : 2 hrs each on XYZ axis Module weight: 15g for 244Ckt and 13g for 200Ckt. EIA 364-28 Mate connectors and shock at 30 g’s with half -sine waveform for 11 milliseconds, 3 shocks in each perpendicular axis (18 shocks total) ...

Page 4

... Solvent 18 Resistance Resistance to 19 Soldering Heat Test REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 TEST CONDITION Mate connectors; expose to 5 cycles of: Temperature °C Duration (Minutes) -55 +0/-3 30 +25 +10/-5 5 MAXIMUM +85 +3/-0 30 +25 +10/-5 5 MAXIMUM EIA-364-32-Test condition l Mate connectors and expose to 500 hours at 105 ± ...

Page 5

... Resistance to Soldering Heat Temp life (pre-conditioning) 105°C – 72hrs Reseating (3X) Sample Size per Test Group 7.0 PACKAGING Parts shall be packed in trays and protected against damage during handling, transportation and storage. REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Test Group ...

Page 6

... Peak 260 +0/-5°C. 4. Component must withstand (2) reflow solder cycles with a cool down between. REVISION: ECR/ECN INFORMATION: S2007-1019 EC No: B DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 260 +0/-5°C 260 TITLE: Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch CREATED / REVISED BY: CHECKED BY: ...

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