87782-2001 Molex Inc, 87782-2001 Datasheet - Page 4

• Manufacturer Part Number: 87782-2001
• Description: CONN SOCKET MINIDIMM VERT SMD
• Manufacturer: Molex Inc
• Series: 87782r

Specifications of 87782-2001

• Connector Style: MiniDIMM
• Number Of Positions: 244
• Memory Type: DDR 2 SDRAM
• Standards: MO-244
• Mounting Type: Surface Mount
• Features: Board Guide, Latches
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Connector Type: DIMM Socket
• No. Of Contacts: 244
• Pitch Spacing: 0.6mm
• Contact Material: Copper
• Contact Plating: Gold
• Contact Termination: Surface Mount Vertical
• Current Rating: 0.5A
• Pitch: 0.6 mm
• Number Of Positions / Contacts: 244
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Housing Material: Thermoplastic, High Temperature
• Voltage Rating: 30 V
• Body Material: LCP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Mounting Feature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 087782-2001; 087782-2001-E; 0877822001; 0877822001-E; 87782-2001-E; 877822001; 877822001-E; WM23938

REVISION: ECR/ECN INFORMATION:
DOCUMENT NUMBER:
B1
5.3 ENVIRONMENTAL REQUIREMENTS
ITEM
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
PS-87782-027
EC No:
DATE:
Reflow Process
Temperature &
Thermal Aging
DESCRIPTION
Solderability
Resistance
Withstand
(Thermal)
Humidity
Porosity
Solvent
Shock
Cyclic
S2008-0204
2007/09/12
PRODUCT SPECIFICATION
Mated, +105±2°C for 500 hours per EIA 364 –
17. Preconditioning to be done at 105°C for 72
hrs
MIL – STD- 202F Method 215J
Solder time: 5±0.5 seconds.
Solder temperature: 245±5°C
Subject to steam aging for 8 hours ± 5 mins.
(For Tin-Lead Version)
Solder time: 5±0.5 seconds.
Solder temperature: 260±5°C
Subject to steam aging for 8 hours ± 5 mins.
(For Tin Version)
EIA 364, TP-53 Nitric Acid Test, 10 contacts
per contact type selected at random
Unmated, exposed to reflow profile as defined
in Section 8.1.
TEST CONDITION
Mate connectors; expose to 5 cycles of:
Temperature °C
EIA-364-32-Test condition l
Mated connectors exposed for 10 days at
25°C to 65°C at 90-98% RH, per EIA 364-31
Method 3.
+25 +10/-5
+85 +3/-0
+25 +10/-5
-55 +0/-3
TITLE:
CREATED / REVISED BY:
ATSEE 2007/09/12
VERTICAL MINI DIMM CONNECTOR
200/244 CKT, 0.60MM PITCH
30
30
Duration (Minutes)
5 MAXIMUM
5 MAXIMUM
SKANG 2007/09/20
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
No change in LLCR greater
than 10 mΩ from initial.
No change in LLCR greater
than 10 mΩ from initial.
No change in LLCR greater
than 10 mΩ from initial.
95% solder coverage
minimum.
Max. number of pores :
30uin-1 pore per 10 contacts
No damage or degradation
of any marking.
No damage or blistering.
REQUIREMENT
MLONG 2007/09/20
APPROVED BY:
SHEET No.
4
of
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