87782-2001 Molex Inc, 87782-2001 Datasheet

CONN SOCKET MINIDIMM VERT SMD

87782-2001

Manufacturer Part Number
87782-2001
Description
CONN SOCKET MINIDIMM VERT SMD
Manufacturer
Molex Inc
Series
87782r
Datasheets

Specifications of 87782-2001

Connector Style
MiniDIMM
Number Of Positions
244
Memory Type
DDR 2 SDRAM
Standards
MO-244
Mounting Type
Surface Mount
Features
Board Guide, Latches
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Connector Type
DIMM Socket
No. Of Contacts
244
Pitch Spacing
0.6mm
Contact Material
Copper
Contact Plating
Gold
Contact Termination
Surface Mount Vertical
Current Rating
0.5A
Pitch
0.6 mm
Number Of Positions / Contacts
244
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Housing Material
Thermoplastic, High Temperature
Voltage Rating
30 V
Body Material
LCP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Mounting Feature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
087782-2001
087782-2001-E
0877822001
0877822001-E
87782-2001-E
877822001
877822001-E
WM23938

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
87782-2001
Manufacturer:
MOLEX
Quantity:
34 769
REVISION: ECR/ECN INFORMATION:
DOCUMENT NUMBER:
1.0 SCOPE
2.0 PRODUCT DESCRIPTION
B1
This Product Specification covers the performance requirements of the 0.60 mm centerline edge
card socket for board to board interconnect of 1.00 mm thick memory modules.
2.1 PRODUCT NAME AND SERIES NUMBER (S)
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
2.3 CONNECTOR SIZE
2.4 PCB / MODULE DIMENSIONS
2.5 SAFETY AGENCY APPROVALS
PS-87782-027
Part Number
87782-2001/2002/2003/2201/2202
See the appropriate Sales Drawings for information on dimensions, materials, plating and
Refer to the appropriate sales drawing for dimensional information and detail.
Refer to the appropriate sales drawing for PCB / module hole layout and dimensional
Information. The connector accommodates a 1.00 ± 0.10mm thick PC module.
markings, recommended module outlines and footprint Specifications.
EC No:
DATE:
S2008-0204
2007/09/12
UL File
CSA File
PRODUCT SPECIFICATION
:
:
TITLE:
CREATED / REVISED BY:
Vertical Mini DIMM Connector
ATSEE 2007/09/12
E29179
1699020 (LR19980)
Product Descriptions
244/200 Ckt Vertical Mini DIMM Socket (Tin Version)
VERTICAL MINI DIMM CONNECTOR
200/244 CKT, 0.60MM PITCH
SKANG 2007/09/20
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
MLONG 2007/09/20
APPROVED BY:
SHEET No.
1
of
6

Related parts for 87782-2001

87782-2001 Summary of contents

Page 1

... PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) Part Number 87782-2001/2002/2003/2201/2202 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate Sales Drawings for information on dimensions, materials, plating and markings, recommended module outlines and footprint Specifications. ...

Page 2

... Multiline Crosstalk REVISION: ECR/ECN INFORMATION: S2008-0204 EC No: B1 DATE: 2007/09/12 DOCUMENT NUMBER: PS-87782-027 TEST CONDITION Mate connectors: apply a maximum voltage of 20mV and a current of 100mA Mated per EIA-364-23 Temperature of mated connector at rated current for 96 hours (6 consecutive ckts link in series.) Unmated per EIA-364-21 ...

Page 3

... REVISION: ECR/ECN INFORMATION: S2008-0204 EC No: B1 DATE: 2007/09/12 DOCUMENT NUMBER: PS-87782-027 TEST CONDITION Amplitude : 1.52mm peak to peak Sweep : 10-55- one min. Duration : 2 hrs each on XYZ axis Module weight : 15g for 244Ckt and 13g for 200Ckt. EIA 364-28 Mated, 30G, 11ms duration, half-sine ...

Page 4

... Porosity Solvent 5.3.6 Resistance Reflow Process 5.3.7 Withstand REVISION: ECR/ECN INFORMATION: S2008-0204 EC No: B1 DATE: 2007/09/12 DOCUMENT NUMBER: PS-87782-027 TEST CONDITION Mate connectors; expose to 5 cycles of: Temperature °C Duration (Minutes) -55 +0/-3 30 +25 +10/-5 5 MAXIMUM +85 +3/-0 30 +25 +10/-5 5 MAXIMUM EIA-364-32-Test condition l Mated, +105± ...

Page 5

... Resistance to Soldering Heat Temp life (pre-conditioning) 105°C – 72hrs Reseating (3X) Sample Size per Test Group 7.0 PACKAGING Parts shall be packed in trays and protected against damage during handling, transportation and storage. REVISION: ECR/ECN INFORMATION: S2008-0204 EC No: B1 DATE: 2007/09/12 DOCUMENT NUMBER: PS-87782-027 Test Group ...

Page 6

... Peak 260 +0/-5°C 4. Component must withstand (2) reflow solder cycles with a cool down between. REVISION: ECR/ECN INFORMATION: S2008-0204 EC No: B1 DATE: 2007/09/12 DOCUMENT NUMBER: PS-87782-027 260+0/-5 °C TITLE: VERTICAL MINI DIMM CONNECTOR 200/244 CKT, 0.60MM PITCH CREATED / REVISED BY: CHECKED BY: ATSEE 2007/09/12 SKANG 2007/09/20 SHEET No ...

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