XF2L-0825-1 Omron, XF2L-0825-1 Datasheet - Page 21

• Manufacturer Part Number: XF2L-0825-1
• Description: CONN FPC 8POS 0.5MM SMT
• Manufacturer: Omron
• Series: XF2Lr
• Type: FPC Connectorr

Specifications of XF2L-0825-1

• Contact Plating: Gold Over Nickel
• Connector Type: Top Contacts
• Number Of Positions: 8
• Pitch: 0.020" (0.50mm)
• Ffc, Fcb Thickness: 0.30mm
• Height Above Board: 0.047" (1.20mm)
• Mounting Type: Surface Mount, Right Angle
• Cable End Type: Straight
• Termination: Solder
• Locking Feature: Slide Lock
• Features: Zero Insertion Force (ZIF)
• Contact Finish: Tin Alloy
• Contact Finish Thickness: 79µin (2.00µm)
• Operating Temperature: -30°C ~ 85°C
• Current Rating: 0.500A
• Voltage Rating: 50V
• Housing Material: Liquid Crystal Polymer (LCP)
• Contact Gender: SKT
• Mounting Style: Surface Mount
• Number Of Contact Rows: 1
• Number Of Contacts: 8POS
• Pitch (mm): 0.5mm
• Body Orientation: Right Angle
• Contact Resistance Max: 30mOhm
• Voltage Rating Max: 50VDC/50VAC
• Operating Temp Range: -30C to 85C
• Current Rating (max): 0.5A
• Housing Color: Natural
• Contact Material: Copper Alloy
• Termination Method: Solder
• Product Height (mm): 1.2mm
• Product Depth (mm): 3.45mm
• Product Length (mm): 8.9mm
• Gender: Receptacle
• Pitch Spacing: 0.5mm
• No. Of Contacts: 8
• No. Of Rows: 1
• Ffc/fpc Thickness: 0.3mm
• Contact Termination: Surface Mount Vertical
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: OR680TR; XF2L08251

Common Precautions for XF Connectors
■ Safety Precautions
● All Models
Operating
• Make sure that the FPC has been inserted correctly and
• Insert the FPC fully to the back of the connector. Failing to
• When inserting and removing the FPC, applying pressure
Designing
• Gently pull out the FPC taking care not to apply force
• When installing the FPC at a location or on equipment that
• Use FPCs that conform to the appropriate specifications
• Use the same metal for the FPC plating and the connector
• “Whiskers” may protrude from the FPC film of some lead-
• Ensure a metal mask thickness of t = 0.12 to 0.15 mm.
Mounting
• Do not perform mounting (reflow or manual soldering) with
• The reflow conditions are as stated in OMRON’s specifica-
• When mounting the connector by manual soldering,
XF
1. Conditions for manual soldering: 350±10°C for 3±1
2. Do not apply an excessive amount of solder. Excessive
3. Do not apply the soldering iron to the mount attachments
4. Do not apply the soldering iron to any parts of the
not backward.
Inserting the FPC incorrectly with the FPC connecting face
not aligned with the customer's design specifications may
damage the contacts and equipment may malfunction.
do so may result in a loss of contact reliability.
from above or below, left to right or at an angle may cause
the FPC contacts to become damaged or detached and
may result in contact failure.
directly to the connector.
Bending the FPC in the area where it enters the connector
or applying force to the FPC itself may result in contact fail-
ure.
will subject the FPC to repeated vibration or movement,
secure the FPC prior to use.
and size as stated by OMRON.
When using a different FPC, or an F/F, contact OMRON.
plating.
free FPCs. Be careful when using these units.
The recommended metal mask open area is 90% of the
printed circuit board mating dimensions given in the dimen-
sions diagrams.
the FPC inserted in the connector. Doing so may result in
contact failure.
tions and guidelines. These conditions, however, depend
on the type of solder, the manufacturer, the amount of sol-
der, the size of the circuit board, and the other mounting
materials. Confirm the mounting conditions before using
the connectors.
observe the following precautions to ensure contact reli-
ability.
1. Conditions for manual soldering: 350±10°C for 3±1 s
2. Do not apply an excessive amount of solder. Excessive
3. Do not apply the soldering iron to the mount attach-
4. Do not apply the soldering iron to any parts of the con-
seconds
solder will cause the fl ux to rise.
using force. Doing so may cause the connectors to
change shape.
connector other than the mount attachments. Doing so
may cause the connector to change shape.
solder will cause the flux to rise.
ments using force. Doing so may cause the connectors
to change shape.
nector other than the mount attachments. Doing so may
cause the connector to change shape.
Precautions for Correct Use
Board Mounting Precautions
Board Mounting Precautions
• Be careful of board warping. The connector flatness is
• Be careful of board warping. The connector fl atness is 0.1
• Do not apply excessive force on the connector before
• Do not apply excessive force on the connector before
• Be careful to not apply an excessive load on the board
• Avoid applying excessive force on the board when
1. Dividing multi-cavity boards.
2. Securing a board with screws.
Storage
1. Do not store the connectors in locations subject to dust or
2. Do not store the connectors in locations close to sources
0.1 mm max. A large amount of warping, however, may
result in soldering faults.
mounting it. The connector may be damaged, resulting in
faulty contacts. Do not insert the FPC and lock the slider
before mounting the connector.
when performing the following actions.
1. Dividing multi-cavity boards.
2. Securing a board with screws.
mm max. A large amount of warping, however, may result
in soldering faults.
mounting it. The connector may be damaged, resulting in
faulty contacts. Do not insert the FPC and lock the slider
before mounting the connector.
performing the following actions:”
high humidity.
of gasses such ammonia gas or sulfide gas.
XF
21