B57421V2103J 62 EPCOS Inc, B57421V2103J 62 Datasheet

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... NTC thermistors for temperature measurement SMD NTC thermistors, case size 0805 (2012) Series/Type: B574**V2 Date: February 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Applications Temperature measurement and compensation Features Multilayer SMD NTC with inner electrodes Nickel barrier termination Excellent long-term aging stability in high-temperature environment Superior resistance stability during soldering (change <1%) Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Electrical specification and ordering codes R No. of R/T 25 characteristic 100 8501 150 8501 220 8501 330 8501 470 8502 680 8502 1.0 k 8502 1.5 k 8502 2.2 k 8502 3.3 k 8502 4.7 k 8500 4 ...

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... Resistance drift after soldering Please read Cautions and warnings and Important notes at the end of this document. Test conditions Storage at upper category temperature T: (125 1000 h Temperature of air: ( Relative humidity of air: (93 +2/ 3)% Duration: 56 days Lower test temperature Upper test temperature: 125 C Number of cycles: 100 P ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) R/T characteristics 8500 R/T No 3650 K 25/100 R /R (%/ 55.0 63.917 6.8 50.0 45.889 6.5 45.0 33.344 6.3 40.0 24.504 6.1 35.0 18.201 5.8 30.0 13.657 5.6 25.0 10.347 5.5 20.0 7.9114 5 ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) R/T characteristics R/T No. 8507 4480 K 25/100 R /R (%/ 55.0 142.71 7.9 50.0 96.913 7.6 45.0 66.637 7.4 40.0 46.366 7.1 35.0 32.629 6.9 30.0 23.213 6.7 25.0 16.686 6.5 20.0 12.115 6 ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Taping and packing 1 Taping of SMD NTC thermistors 1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3) Dimensions (mm) Case size Case size 0402 0603 (8-mm tape) (8-mm tape) ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) 1.2 Blister tape for case size 0805 (taping to IEC 60286-3) Dimensions (mm) Case size Tolerance 0805 (8-mm tape 1.60 2.40 0 1.40 max 2.5 max 1.50 +0.10/– 1.00 min 4.00 0.10 ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) 1.3 Reel packing Packing survey Case Chip 8-mm tape size thick- 3) ness mm Blister Card- board 0402 0.5 x 0603 0.8 x 0805 0 Chip thickness depends on the resistance value. Please read Cautions and warnings and Important notes at the end of this document ...

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... Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges 1/3. Solder SnPb 60/40 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) Please read Cautions and warnings and Important notes at the end of this document. Bath temperature ( C) 215 3 245 3 Bath temperature ( C) 260 5 260 5 Page B574**V2 Dwell time ( ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page B574**V2 ...

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... Time within actual peak temperature ( Ramp-down rate Time peak temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Please read Cautions and warnings and Important notes at the end of this document. Sn-Pb eutectic assembly 3 C/ second max. 100 C 150 C 60 ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Solder joint profiles for silver/nickel/tin terminations 1.1.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size A B inch/mm 0402/1005 0.6 0.6 0603/1608 1.0 1.0 0805/2012 1.3 1.2 1.1.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. ...

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... When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) 6 Placement and orientation of SMD NTC thermistors on PCB a) Component placement b) Cracks c) Component orientation Please read Cautions and warnings and Important notes at the end of this document recommended that the PC board should be held by means of some ...

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... See "Important notes" at the end of this document. Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or components may stick together, causing problems during mounting ...

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... Electrodes/contacts must not be scratched or damaged before/during/after the mounting process. Contacts and housing used for assembly with the thermistor must be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. ...

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... R /R Resistance tolerance caused spread of B value R Insulation resistance ins R Parallel resistance P R Rated resistance Resistance tolerance Series resistance S R Resistance at temperature T T (e. resistance Temperature T Temperature tolerance t Time T Ambient temperature A T Upper category temperature max T Lower category temperature min T Operating temperature op T ...

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... Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) Symbol English Temperature coefficient Tolerance, change Dissipation factor th Thermal cooling time constant c Thermal time constant a Abbreviations / Notes Symbol English Surface-mounted devices * To be replaced by a number in ordering codes, type designations etc. ...

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Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical ...