APDS-9008-020 Avago Technologies US Inc., APDS-9008-020 Datasheet - Page 9

• Manufacturer Part Number: APDS-9008-020
• Description: IC PHOTOSENSOR AMBIENT 6CHIPLED
• Manufacturer: Avago Technologies US Inc.
• Type: Ambient Light Photo Sensorr

Specifications of APDS-9008-020

• Package / Case: 6-ChipLED - 1.60mm L x 1.50mm W x 0.55mm H
• Wavelength: 565nm
• Output Type: Analog
• Peak Wavelength: 565 nm
• Maximum Light Current: 52 uA
• Maximum Dark Current: 300 nA
• Maximum Rise Time: 5 ms
• Maximum Fall Time: 5 ms
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Product: Ambient Light Sensor
• Output Current: 40µA
• Sensor Output: Analog
• Supply Voltage Range Dc: 1.6V To 5.5V
• Length/height, External: 0.55mm
• Peak Reflow Compatible (260 C): Yes
• External Width: 1.6mm
• Rise Time: 5ms
• Rohs Compliant: Yes
• External Depth: 1.5mm
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow sol-
der process. The temperature profile is divided into four
process zones, each with different ΔT/Δtime temperature
change rates or duration. The ΔT/Δtime rates or duration
are detailed in the above table. The temperatures are
measured at the component to printed circuit board con-
nections.
Process zone P1
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is lim-
ited to 3°C per second to allow for even heating of both
the PC board and component pins.
Process zone P2
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the sol-
der.
Process zone P3
temperature is quickly raised above the liquidus point of
9
150
120
255
230
217
200
180
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point , 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
, the PC board and component pins are
should be of sufficient time duration (100
R1
is the solder reflow zone. In zone P3, the
HEAT
UP
P1
50
R2
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
SOLDER PASTE DRY
100
P2
150
ΔT
25°C to 150°C
150°C to 200°C
200°C to 260°C
260°C to 200°C
200°C to 25°C
> 217°C
260°C
>255°C
25°C to 260°C
solder to 260°C (500°F) for optimum results. The dwell time
above the liquidus point of solder should be between 60
and 120 seconds. This is to assure proper coalescing of the
solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time
the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak
and unreliable connections. The temperature is then rap-
idly reduced to a point below the solidus temperature of
the solder to allow the solder within the connections to
freeze solid.
Process zone P4
cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maxi-
mum. This limitation is necessary to allow the PC board
and component pins to change dimensions evenly, put-
ting minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
R3
60 sec to 90 sec
Above 217°C
MAX 260°C
200
REFLOW
SOLDER
P3
R4
is the cool down after solder freeze. The
Maximum ΔT/Δtime or
Duration
3°C/s
100s to 180s
3°C/s
-6°C/s
-6°C/s
60s to 120s
-
20s to 40s
8mins
COOL DOWN
250
P4
R5
300
(SECONDS)
t-TIME