APDS-9007-020 Avago Technologies US Inc., APDS-9007-020 Datasheet - Page 10

AMBIENT LIGHT SENSOR 6CHIPLED

APDS-9007-020

Manufacturer Part Number
APDS-9007-020
Description
AMBIENT LIGHT SENSOR 6CHIPLED
Manufacturer
Avago Technologies US Inc.
Type
Ambient Light Sensor with Logarithmic Current Outputr
Datasheet

Specifications of APDS-9007-020

Peak Wavelength
560 nm
Maximum Light Current
39 uA
Maximum Rise Time
0.2 ms
Maximum Fall Time
0.2 ms
Package / Case
Chip LED-6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Product
Ambient Light Sensor
Sensor Output
Current
Supply Voltage Range Dc
2V To 3.6V
Active Area
0.1540mm
External Depth
2.0mm
External Width
2.4mm
Leaded Process Compatible
Yes
Length/height, External
0.8mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1719-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
APDS-9007-020
Manufacturer:
HOLTEK
Quantity:
12 000
2.2
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
Figure A2. Recommended Land Pattern
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick
stencil be used for solder paste printing. Aperture
opening for shield pad is 0.9mm x 0.8mm (as per land
pattern). This is to ensure adequate printed solder paste
volume and no shorting.
Figure A3. Solder Stencil Aperture
10
Mounting
Center
Aperture
Opening
Stencil
Aperture
Solder
Mask
Unit:
mm
0.8
0.8
0.9
0.7
1.4
3.2
0.3
0.9
Metal Stencil For
Solder Paste
Printing
Land
Pattern
3.2
PCBA
0.6
Unit: mm
2.2
0.1
1
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area.
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
Figure A4. Adjacent Land Keepout and Solder Mask Areas
Mounting
Center
Unit:
mm
0.2
MIN.
3.2
4.2

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