APDS-9800-021 Avago Technologies US Inc., APDS-9800-021 Datasheet - Page 10

• Manufacturer Part Number: APDS-9800-021
• Description: IC PROXIMITY SENSOR AMB LT 10QFN
• Manufacturer: Avago Technologies US Inc.
• Type: Integrated Ambient Light and Proximity Sensorr

Specifications of APDS-9800-021

• Output Type: Analog, Digital
• Sensor Type: Light and Proximity
• Maximum Light Current: 26 uA
• Maximum Dark Current: 300 nA
• Maximum Rise Time: 5 ms
• Maximum Fall Time: 5 ms
• Mounting Style: SMD/SMT
• Product: Integrated Ambient Light and Proximity Sensor
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-2170-2; APDS-9800-021

Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different ∆T/∆time tem-
perature change rates or duration. The ∆T/∆time rates or
duration are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In process zone P1, the PC board and component pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of both
the PC board and component pins.
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder.
10
120
255
230
217
200
180
150
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time Maintained Above Liquidus Point, 217°C
Peak Temperature
Time within 5°C of Actual Peak Temperature
Time 25°C to Peak Temperature
0
HEAT
R1
P1
UP
50
R2
SOLDER PASTE DRY
100
P2
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
150
150°C to 200°C
200°C to 260°C
260°C to 200°C
25°C to 150°C
200°C to 25°C
25°C to 260°C
> 217°C
> 255°C
260°C
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time
above the liquidus point of solder should be between 60
and 120 seconds. This is to assure proper coalescing of the
solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell
time the intermetallic mm growth within the solder con-
nections becomes excessive, resulting in the formation of
weak and unreliable connections. The temperature is then
rapidly reduced to a point below the solidus temperature
of the solder to allow the solder within the connections to
freeze solid.
Process zone P4 is the cool down after solder freeze. The cool
down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting
minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
∆T
R3
60 sec to 90 sec
Above 217 C
MAX 260C
200
REFLOW
SOLDER
P3
Maximum ∆T/∆time or Duration
R4
COOL DOWN
250
100s to 180s
60s to 120s
20s to 40s
8minutes
P4
R5
-6°C/s
-6°C/s
3°C/s
3°C/s
–
(SECONDS)
t-TIME
300