S29AL016D70TFI010 Spansion Inc., S29AL016D70TFI010 Datasheet - Page 53

• Manufacturer Part Number: S29AL016D70TFI010
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL016D70TFI010

• Memory Size: 16Mbit
• Memory Configuration: 2M X 8 / 1M X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Erase and Programming Performance
Notes:
1. Typical program and erase times assume the following conditions: 25
2. Under worst case conditions of 90°C, V
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program
6. The device has a minimum erase and program cycle endurance of 100,000 cycles per sector.
TSOP and BGA Pin Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
December 17, 2004 S29AL016D_00_A2
Parameter
Sector Erase Time
Chip Erase Time
Byte Programming Time
Word Programming Time
Chip Programming Time
(Note
data pattern.
bytes program faster than the maximum program times listed.
command. See
Parameter
Symbol
3)
C
C
C
OUT
IN2
IN
Table 9
A
= 25°C, f = 1.0 MHz.
for further information on command definitions.
Word Mode
Byte Mode
Parameter Description
Control Pin Capacitance
Output Capacitance
Input Capacitance
P r e l i m i n a r y
Typ
CC
= 2.7 V, 1,000,000 cycles.
(Note
0.7
7.2
25
11
5
7
1)
S29AL016D
Max
Test Setup
21.6
V
(Note
150
210
V
V
10
33
OUT
IN
IN
= 0
= 0
= 0
2)
°
C, V
CC
= 3.0 V, 100,000 cycles, checkerboard
Package
Unit
µs
µs
TSOP
TSOP
TSOP
s
s
s
s
BGA
BGA
BGA
Excludes 00h programming
prior to erasure
Excludes system level
overhead
Typ
4.2
8.5
5.4
7.5
3.9
6
Comments
(Note
Max
7.5
5.0
6.5
4.7
12
9
5)
(Note
Unit
4)
pF
pF
pF
pF
pF
pF
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