PIC24FJ64GA006T-I/PT Microchip Technology, PIC24FJ64GA006T-I/PT Datasheet - Page 4
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PIC24FJ64GA006T-I/PT
Manufacturer Part Number
PIC24FJ64GA006T-I/PT
Description
Microcontroller
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ16GA002-ISS.pdf
(52 pages)
2.PIC24FJ64GA006-IPT.pdf
(240 pages)
3.PIC24FJ64GA006-IPT.pdf
(22 pages)
Specifications of PIC24FJ64GA006T-I/PT
Core Processor
PIC
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (22K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
53
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DV164033, MA240013, AC164127, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUDV164033 - KIT START EXPLORER 16 MPLAB ICD2MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ64GA006T-I/PT
Manufacturer:
MICROCHIP
Quantity:
1 000
Company:
Part Number:
PIC24FJ64GA006T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC24FJXXXGA0XX
Pin Diagrams
DS39768D-page 4
28-Pin PDIP, SSOP, SOIC
28-Pin QFN
Legend:
Note 1:
PGC1/EMUC1/AN3/C2IN+/RP1/CN5/RB1
PGD1/EMUD1/AN2/C2IN-/RP0/CN4/RB0
PGD3/EMUD3/RP5/SDA1/CN27/PMD7/RB5
PGC1/EMUC1/AN3/C2IN+/RP1/CN5/RB1
PGD1/EMUD1/AN2/C2IN-/RP0/CN4/RB0
RPx represents remappable peripheral pins.
The bottom pad of QFN packages should be connected to V
(1)
RB2
RB3
RA2
RA3
V
SS
MCLR
RA0
RA1
RB2
RB3
RA2
RA3
RB4
RA4
V
V
DD
SS
1
2
3
4
5
6
7
PIC24FJXXGA002
28
8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
27
9
10 11
26
25
12 13 14
24
28
27
26
25
24
23
22
21
20
19
18
17
16
15
23
22
21
20
19
18
17
16
15
V
V
RB15
RB14
RB13
RB12
PGC2/EMUC2/TMS/RP11/CN15/PMD1/RB11
PGD2/EMUD2/TDI/RP10/CN16/PMD2/RB10
V
DISVREG
RB9
RB8
RB7
PGC3/EMUC3/RP6/SCL1/CN24/PMD6/RB6
DD
SS
CAP
RB13
RB12
PGC2/EMUC2/TMS/RP11/CN15/PMD1/RB11
PGD2/EMUD2/TDI/RP10/CN16/PMD2/RB10
V
DISVREG
RB9
/V
CAP
DDCORE
SS
/V
.
DDCORE
© 2008 Microchip Technology Inc.