PIC16F685-I/ML Microchip Technology, PIC16F685-I/ML Datasheet - Page 241
PIC16F685-I/ML
Manufacturer Part Number
PIC16F685-I/ML
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,20PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F690DM-PCTLHS.pdf
(306 pages)
3.PIC16F677-IP.pdf
(2 pages)
4.PIC16F677-IP.pdf
(16 pages)
Specifications of PIC16F685-I/ML
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PINDVA1004 - DEVICE ADAPTER 8/14/20DIP
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F690DM-PCTLHS PDF datasheet #2
- PIC16F677-IP PDF datasheet #3
- PIC16F677-IP PDF datasheet #4
- Current page: 241 of 306
- Download datasheet (6Mb)
17.5
© 2008 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
DD
A
JA
JC
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
PIC16F631/677/685/687/689/690
A
≤ +125°C
108.1
Typ.
62.4
85.2
28.1
24.2
32.2
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
OL
(T
+ P
x V
DIE
) + Σ (I
DD
I
/
O
- T
DS41262E-page 239
A
OH
)/θ
* (V
JA
DD
- V
OH
))
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