PIC16C765-I/PT Microchip Technology, PIC16C765-I/PT Datasheet - Page 154

• Manufacturer Part Number: PIC16C765-I/PT
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TQFP,44PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C765-I/PT

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: SCI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.35 V ~ 5.25 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 3 bit
• Operating Supply Voltage: 4.35 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFPISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC16C745/765
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS41124C-page 154
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
n1
A1
E1
A
E
D
B
n
p
L
c
n
MIN
Preliminary
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.398
.398
.008
.017
.045
.482
.482
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2000 Microchip Technology Inc.
12.00
12.00
10.00
10.00
0.80
1.10
1.00
0.10
0.60
0.15
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7