PIC12F508T-I/MC Microchip Technology, PIC12F508T-I/MC Datasheet - Page 46
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PIC12F508T-I/MC
Manufacturer Part Number
PIC12F508T-I/MC
Description
768 B Flash, 25 RAM, 6 I/O 8 DFN 2X3mm T/R
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F509T-ISN.pdf
(110 pages)
2.PIC12F509T-ISN.pdf
(4 pages)
3.PIC12F509T-ISN.pdf
(20 pages)
Specifications of PIC12F508T-I/MC
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
768B (512 x 12)
Program Memory Type
FLASH
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F508T-I/MC
Manufacturer:
TRIQUINT
Quantity:
187
PIC12F508/509/16F505
Although the oscillator will operate with no external
capacitor (C
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or
package lead frame capacitance.
Section 10.0 “Electrical Characteristics” shows RC
frequency variation from part-to-part due to normal
process variation. The variation is larger for larger val-
ues of R (since leakage current variation will affect RC
frequency more for large R) and for smaller values of C
(since variation of input capacitance will affect RC
frequency more).
Also, see the Electrical Specifications section for
variation of oscillator frequency due to V
R
to operating temperature for given R, C and V
values.
FIGURE 7-5:
7.2.5
The internal RC oscillator provides a fixed 4 MHz
(nominal) system clock at V
Section 10.0
information on variation over voltage and temperature).
DS41236E-page 46
EXT
C
V
R
EXT
SS
EXT
/C
V
F
OSC
EXT
DD
/4
values, as well as frequency variation due
INTERNAL 4 MHz RC OSCILLATOR
EXT
= 0 pF), we recommend using values
“Electrical
EXTERNAL RC
OSCILLATOR MODE
OSC1
OSC2/CLKOUT
N
DD
Characteristics”
= 5V and 25°C, (see
PIC16F505
PIC12F508
PIC12F509
DD
Internal
clock
for given
DD
for
In addition, a calibration instruction is programmed into
the last address of memory, which contains the
calibration value for the internal RC oscillator. This
location is always uncode protected, regardless of the
code-protect settings. This value is programmed as a
MOVLW XX instruction where XX is the calibration value,
and is placed at the Reset vector. This will load the W
register with the calibration value upon Reset and the
PC will then roll over to the users program at address
0x000. The user then has the option of writing the value
to the OSCCAL Register (05h) or ignoring it.
OSCCAL, when written to with the calibration value, will
“trim” the internal oscillator to remove process variation
from the oscillator frequency.
For the PIC12F508/509/16F505 devices, only bits
<7:1> of OSCCAL are implemented. Bits CAL6-CAL0
are used for calibration. Adjusting CAL6-CAL0 from
‘0000000’ to ‘1111111’ changes the clock speed. See
Register 4-5 for more information.
Note:
Note:
Erasing the device will also erase the pre-
programmed internal calibration value for
the internal oscillator. The calibration
value must be read prior to erasing the
part so it can be reprogrammed correctly
later.
The 0 bit of OSCCAL is unimplemented
and should be written as ‘0’ when
modifying OSCCAL for compatibility with
future devices.
© 2009 Microchip Technology Inc.