DSPIC30F3011-20E/PT Microchip Technology, DSPIC30F3011-20E/PT Datasheet - Page 170
DSPIC30F3011-20E/PT
Manufacturer Part Number
DSPIC30F3011-20E/PT
Description
IC,DSP,16-BIT,CMOS,TQFP,44PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F3010-30ISO.pdf
(228 pages)
4.DSPIC30F3010-30ISO.pdf
(18 pages)
5.DSPIC30F3010-30ISO.pdf
(6 pages)
6.DSPIC30F3010-30ISO.pdf
(16 pages)
7.DSPIC30F3010-30ISO.pdf
(22 pages)
Specifications of DSPIC30F3011-20E/PT
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
24KB (8K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F3011-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F3010-30ISO PDF datasheet #3
- DSPIC30F3010-30ISO PDF datasheet #4
- DSPIC30F3010-30ISO PDF datasheet #5
- DSPIC30F3010-30ISO PDF datasheet #6
- DSPIC30F3010-30ISO PDF datasheet #7
- Current page: 170 of 228
- Download datasheet (4Mb)
dsPIC30F3010/3011
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70141F-page 170
dsPIC30F301X-30I
dsPIC30F301X-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP (PT, 10x10x1 mm)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
I
INT
/
Junction to ambient thermal resistance, Theta-ja (θ
Range
O
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
{
DD
V
×
DD
(
I
–
D D
V
Characteristic
–
OH
∑
Rating
}
×
I
O H
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
I
Temp Range
OH
)
)
+
∑
(
V
O L
×
I
OL
)
dsPIC30F301X-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
20
10
—
—
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
42
49
37
45
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
—
—
—
dsPIC30F301X-20E
+ P
A
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
Max
Unit
—
—
—
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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