DSPIC30F2023-20E/PT Microchip Technology, DSPIC30F2023-20E/PT Datasheet - Page 274
DSPIC30F2023-20E/PT
Manufacturer Part Number
DSPIC30F2023-20E/PT
Description
12KB, Flash, 512bytes-RAM, 30MIPS, 35I/O, 16-bit Family,nanoWatt 44 TQFP 10x10x1
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2023-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Package
44TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
35
Interface Type
I2C/SPI/UART
On-chip Adc
12-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F2023-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- AC164335 PDF datasheet
- DM300023 PDF datasheet #2
- DM300023 PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20IP PDF datasheet #5
- DSPIC30F1010-30ISO PDF datasheet #6
- DSPIC30F1010-30ISO PDF datasheet #7
- Current page: 274 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body (QFN)
DS70178C-page 272
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
2
1
Preliminary
E
EXPOSED
A
NOTE 1
PAD
E2
Units
A1
A3
E2
D2
N
D
e
A
E
b
L
K
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
—
© 2006 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
b
K
e
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