DSPIC30F2020-20E/MM Microchip Technology, DSPIC30F2020-20E/MM Datasheet - Page 12

• Manufacturer Part Number: DSPIC30F2020-20E/MM
• Description: 12KB, Flash, 512bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 QFN-S 6x6mm
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2020-20E/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-QFN
• Package: 28QFN-S EP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

5.7.5
The dsPIC30F SMPS devices contain 32 instructions
of Unit ID. These are located at addresses 0x8005C0
through 0x8005FF. The Unit ID can be used for storing
product information such as serial numbers, system
manufacturing dates, manufacturing lot numbers and
FIGURE 5-5:
DS70284C-page 12
USER UNIT ID
ConfigAddress =
ConfigAddress+2
CONFIGURATION BIT PROGRAMMING FLOW
No
PROGC Response
ConfigAddress
0xF8000C?
Send PROGC
Command
PASS?
Finish
Start
other
Programming the UNIT ID is similar to programming
the
“Programming the Programming Executive to
Memory”
Is
Is
Yes
Yes
Programming
ConfigAddress = 0xF80000
such
for details).
No
application-specific
Executive
Report Error
© 2010 Microchip Technology Inc.
Failure
(see
Section 12.0
information.