PIC24FJ64GB004-I/ML Microchip Technology, PIC24FJ64GB004-I/ML Datasheet - Page 307
PIC24FJ64GB004-I/ML
Manufacturer Part Number
PIC24FJ64GB004-I/ML
Description
IC, 16BIT MCU, PIC24F, 32MHZ, QFN-44
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.PIC24FJ32GA102-ISP.pdf
(48 pages)
2.PIC24FJ32GB002-ISO.pdf
(352 pages)
3.PIC24FJ32GB002-ISO.pdf
(12 pages)
4.PIC24FJ32GB002-ISO.pdf
(342 pages)
Specifications of PIC24FJ64GB004-I/ML
Controller Family/series
PIC24
Ram Memory Size
8KB
Cpu Speed
32MHz
No. Of Timers
5
Interface
I2C, LIN, SPI, UART, USB
No. Of Pwm Channels
5
Core Size
16 Bit
Program Memory Size
64 KB
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Embedded Interface Type
I2C, LIN, SPI, UART, USB
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ64GB004-I/ML
Manufacturer:
MICROCHIP
Quantity:
1 200
- PIC24FJ32GA102-ISP PDF datasheet
- PIC24FJ32GB002-ISO PDF datasheet #2
- PIC24FJ32GB002-ISO PDF datasheet #3
- PIC24FJ32GB002-ISO PDF datasheet #4
- Current page: 307 of 352
- Download datasheet (3Mb)
TABLE 29-1:
TABLE 29-2:
2010 Microchip Technology Inc.
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
= ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
DD
– V
Characteristic
OH
– I
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
PIC24FJ64GB004 FAMILY
)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
33.7
39.3
Min
Typ
-40
-40
49
28
(T
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39940D-page 307
+140
+125
°C/W
°C/W
°C/W
°C/W
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W
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