S29AL032D70BFI030 Spansion Inc., S29AL032D70BFI030 Datasheet - Page 13

• Manufacturer Part Number: S29AL032D70BFI030
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL032D70BFI030

• Memory Size: 32Mbit
• Memory Configuration: 4M X 8 / 2M X 16
• Ic Interface Type: CFI, Parallel
• Access Time: 70ns
• Memory Case Style: FBGA
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6.
6.1
Notes
1. Type 0 is standard. Specify other options as required.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
January 19, 2007 S29AL032D_00_A9
S29AL032D
Device Number
S29AL032D
Ordering Information
S29AL032D Standard Products
Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
70
DEVICE NUMBER/DESCRIPTION
S29AL032D
3.0 Volt-only, 32 Megabit Standard Flash Memory, manufactured using 200 nm process technology
Option
Speed
T
70
90
S29AL032D Valid Combinations
A
Package Type, Material,
I
BAI, BFI, BAN, BFN
TAI, TFI, TAN, TFN
and Temperature
00
BAI, BFI
D a t a
TAI, TFI
Range
0
PACKING TYPE
0
2
3
MODEL NUMBER
00
03
04
TEMPERATURE RANGE
I
N
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
SPEED OPTION
See
S h e e t
Product Selector Guide
=
=
=
=
=
=
=
=
=
=
=
=
S29AL032D
Tray
7” Tape and Reel
13” Tape and Reel
x8, V
x8/x16, V
sectors protected when WP#/ACC = V
x8/x16, V
address sectors protected when WP#/ACC = V
Industrial (–40
Extended (-40°C to +125°C)
Standard
Pb-Free
Thin Small Outline Package (TSOP) Standard Pinout
Fine-pitch Ball-Grid Array Package
00, 03, 04
00, 03, 04
Number
Model
03, 04
03, 04
00
00
CC
= 2.7 V to 3.6 V, Uniform sector device
CC
CC
= 2.7 V to 3.6 V, Top boot sector device, top two address
= 2.7 V to 3.6 V, Bottom boot sector device, bottom two
°
C to +85
0, 2, 3
0, 2, 3
Packing Type
0, 3
0, 3
and Valid Combinations
(Note 1)
(Note 1)
(Note 1)
(Note 1)
°
C)
VBN048
VBN048
TS040
TS048
TS040
TS048
IL
Package Description
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 3)
(Note 3)
IL
Fine-Pitch
Fine-Pitch
TSOP
TSOP
BGA
BGA
11