IS43R16160B-6TL INTEGRATED SILICON SOLUTION (ISSI), IS43R16160B-6TL Datasheet - Page 37

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IS43R16160B-6TL

Manufacturer Part Number
IS43R16160B-6TL
Description
SDRAM, DDR, 16M X 16, 2.5V, 66TSOP2
Manufacturer
INTEGRATED SILICON SOLUTION (ISSI)
Datasheet

Specifications of IS43R16160B-6TL

Access Time
0.7ns
Page Size
256Mbit
Memory Case Style
TSOP-2
No. Of Pins
66
Operating Temperature Range
0°C To +70°C
Memory Type
DRAM - Synchronous
Memory Configuration
4 BLK (4M X 16)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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IS43R83200B
IS43R16160B, IC43R16160B
Integrated Silicon Solution, Inc.
Rev. B
10/31/08
[DM CONTROL]
[Power DOWN]
DM is defined as the data mask for writes. During writes,DM masks input data word by word. DM
to write mask latency is 0.
The purpose of CLK suspend is power down. CKE is synchronous input except during the self-
refresh mode. A command at cycle is ignored. From CKE=H to normal function, DLL recovery time
is NOT required in the condition of the stable CLK operation during the power down mode.
Command
Command
Command
/CLK
DQS
CLK
DM
DQ
/CLK
CKE
CKE
CLK
WRITE
PRE
ACT
masked by DM=H
D0 D1
NOP
NOP
D3 D4
Power Down by CKE
DM Function(BL=8,CL=2)
Standby Power Down
D5 D6
Active Power Down
D7
READ
NOP
NOP
Don't Care
Valid
Valid
Q0
Q1
tXPNR/tXPRD
Q2
Q3
Q4
Q5
Q6
37

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