TLD5098EL Infineon Technologies, TLD5098EL Datasheet - Page 9

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TLD5098EL

Manufacturer Part Number
TLD5098EL
Description
IC DC-DC CTRLR BUCK BOOST 14SSOP
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLD5098EL

Constant Current
Yes
Constant Voltage
Yes
Internal Driver
No
Type - Primary
Automotive
Mounting Type
Surface Mount
Topology
PWM, SEPIC, Step-Down (Buck), Step-Up (Boost)
Number Of Outputs
1
Frequency
100kHz ~ 500kHz
Voltage - Supply
4.5 V ~ 45 V
Voltage - Output
4.5 V ~ 5.5 V
Package / Case
14-LSSOP (0.150", 3.95mm Width) Exposed Pad
Packages
PG-SSOP-14
Vs (min)
4.75 V
Vs (max)
45.0 V
Vq (max)
-
Iq (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
 Details

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Manufacturer
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Infineon
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0
4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Pos.
4.3.1 Junction to Case
4.3.2 Junction to Ambient
4.3.3
4.3.4
1) Not subject to production test, specified by design.
2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins and the exposed pad are fixed to
3) Specified
Datasheet
ambient temperature). Ta=25°C; The IC is dissipating 1W.
area at natural convection on FR4 board; The device was simulated on a 76.2 x 114.3 x 1.5 mm board. The 2s2p board
has 2 outer copper layers (2 x 70µm Cu) and 2 inner copper layers (2 x 35µm Cu). A thermal via (diameter = 0.3 mm and
25 µm plating) array was applied under the exposed pad and connected the first outer layer (top) to the first inner layer and
second outer layer (bottom) of the JEDEC PCB. Ta=25°C; The IC is dissipating 1W.
to www.jedec.org.
Parameter
R
Thermal Resistance
thJA
value is according to JEDEC 2s2p (JESD 51-7) + (JESD 51-5) and JEDEC 1s0p (JESD 51-3) + heatsink
1) 2)
1) 3)
Symbol
R
R
R
R
thJC
thJA
thJA
thJA
Min.
9
Limit Values
Typ.
10
47
54
64
Max.
General Product Characteristics
Unit
K/W
K/W
K/W
K/W
Conditions
1s0p + 600 mm
1s0p + 300 mm
2s2p
Rev. 1.0, 2010-10-13
TLD5098EL
2
2

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