LPC2102FBD48,118 NXP Semiconductors, LPC2102FBD48,118 Datasheet - Page 30

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LPC2102FBD48,118

Manufacturer Part Number
LPC2102FBD48,118
Description
IC ARM7 MCU FLASH 16K 48-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet

Specifications of LPC2102FBD48,118

Core Processor
ARM7
Core Size
16/32-Bit
Speed
70MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Core
ARM7TDMI-S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2102FBD48,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2101_02_03_4
Product data sheet
10.2 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
smaller accordingly to the increase in parasitics of the PCB layout.
Rev. 04 — 2 June 2009
Single-chip 16-bit/32-bit microcontrollers
x1
and C
LPC2101/02/03
x2
x1
should be chosen
and C
© NXP B.V. 2009. All rights reserved.
x2
, and C
x3
30 of 37
in

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