LPC1342FBD48,151 NXP Semiconductors, LPC1342FBD48,151 Datasheet - Page 42

IC MCU 32BIT 48LQFP

LPC1342FBD48,151

Manufacturer Part Number
LPC1342FBD48,151
Description
IC MCU 32BIT 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Datasheet

Specifications of LPC1342FBD48,151

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
40
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
LPC1342
Core
ARM Cortex-M3
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, USB, UART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
42
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-5214

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1342FBD48,151
Manufacturer:
TI
Quantity:
115
Part Number:
LPC1342FBD48,151
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
10. Dynamic characteristics
Table 11.
T
[1]
[2]
Table 12.
T
[1]
[2]
LPC1311_13_42_43
Product data sheet
Symbol
N
t
t
t
Symbol
f
T
t
t
t
t
ret
er
prog
osc
CHCX
CLCX
CLCH
CHCL
amb
amb
Fig 20. External clock timing (with an amplitude of at least V
cy(clk)
endu
Number of program/erase cycles.
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
= −40 °C to +85 °C, unless otherwise specified.
= −40 °C to +85 °C; V
Flash characteristics
Dynamic characteristic: external clock
10.1 Flash memory
10.2 External clock
Parameter
endurance
retention time
erase time
programming time
Parameter
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
DD
over specified ranges.
All information provided in this document is subject to legal disclaimers.
sector or multiple
Conditions
powered
unpowered
consecutive sectors
t
CHCL
Rev. 3 — 10 August 2010
[1]
Conditions
t
CLCX
i(RMS)
T
cy(clk)
= 200 mV)
t
CLCH
t
[1]
[2]
CHCX
Min
1
40
T
T
-
-
cy(clk)
cy(clk)
32-bit ARM Cortex-M3 microcontroller
Min
10000
10
20
95
0.95
LPC1311/13/42/43
× 0.4
× 0.4
002aaa907
Typ
-
-
100
1
-
Typ
-
-
-
-
-
-
[2]
© NXP B.V. 2010. All rights reserved.
1.05
Max
-
-
-
105
Max
25
1000
-
-
5
5
Unit
cycles
years
years
ms
42 of 62
ms
Unit
MHz
ns
ns
ns
ns
ns

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