MSC7116VF1000 Freescale Semiconductor, MSC7116VF1000 Datasheet - Page 49

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MSC7116VF1000

Manufacturer Part Number
MSC7116VF1000
Description
DSP 16BIT W/DDR CTRLR 400-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MSC711x StarCorer
Type
Fixed Pointr
Datasheet

Specifications of MSC7116VF1000

Interface
Host Interface, I²C, UART
Clock Rate
266MHz
Non-volatile Memory
ROM (8 kB)
On-chip Ram
400kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
-40°C ~ 105°C
Mounting Type
*
Package / Case
400-MAPBGA
Device Core Size
16b
Format
Fixed Point
Clock Freq (max)
266MHz
Mips
266
Device Input Clock Speed
266MHz
Ram Size
192KB
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
1.2/2.5/3.3V
Operating Supply Voltage (min)
1.14/2.38/3.14V
Operating Supply Voltage (max)
1.26/2.63/3.47V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
400
Package Type
MA-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MSC7116VF1000
Manufacturer:
SONY
Quantity:
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Part Number:
MSC7116VF1000
Manufacturer:
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Quantity:
10 000
3.2.7
One of the most common ways to derive power is to use either a simple fixed or adjustable linear regulator. For the system I/O
voltage supply, a simple fixed 3.3 V supply can be used. However, a separate adjustable linear regulator supply for the core
voltage V
requirements.
3.3
The following equations permit estimated power usage to be calculated for individual design conditions. Overall power is
derived by totaling the power used by each of the major subsystems:
This equation combines dynamic and static power. Dynamic power is determined using the generic equation:
3.3.1
Estimation of core power is straightforward. It uses the generic dynamic power equation and assumes that the core load
capacitance is 750 pF, core voltage swing is 1.2 V, and the core frequency is 266 MHz. This yields:
This equation allows for adjustments to voltage and frequency if necessary.
Freescale Semiconductor
Core
Memory
Reference
I/O
where,
DDC
Supply
Estimated Power Usage Calculations
Power Supply Design
Core Power
should be implemented. For the memory power supply, regulators are available that take care of all DDR power
C = load capacitance in pF
V = peak-to-peak voltage swing in V
F = frequency in MHz
P
TOTAL
P
CORE
Table 33. Recommended Power Supply Ratings
= P
= 750 pF × (1.2 V)
CORE
Symbol
V
V
V
V
+ P
DDIO
DDM
DDC
REF
MSC7116 Data Sheet, Rev. 13
C × V
PERIPHERALS
2
× F × 10
2
× 266 MHz × 10
+ P
–3
DDRIO
mW
Nominal Voltage
+ P
–3
1.25 V
1.2 V
2.5 V
3.3 V
IO
= 287 mW
+ P
LEAKAGE
Hardware Design Considerations
Current Rating
10 µA per device
1.5 A per device
0.5 A per device
1.0 A per device
Eqn. 3
Eqn. 4
Eqn. 5
49

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