IP3253CZ16-8,118 NXP Semiconductors, IP3253CZ16-8,118 Datasheet
IP3253CZ16-8,118
Specifications of IP3253CZ16-8,118
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IP3253CZ16-8,118 Summary of contents
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IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network with high level ESD protection to IEC 61000-4-2 level 4 Rev. 03 — 23 March 2010 1. Product profile 1.1 General description The IP3253/54CZ8/CZ12/CZ16 family consists of 4-, 6- and 8-channel ...
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... NXP Semiconductors 2. Pinning information Table 1. Pinning IP3253/54CZ8/CZ12/CZ16 Pin Description CZ8 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground CZ12 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 fi ...
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... UTLP based; body 1.35 IP3253CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 IP3253CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 IP3254CZ8-4 HXSON8U plastic thermal enhanced extremely thin small outline package ...
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... NXP Semiconductors 5. Characteristics Table 4. Channel characteristics unless otherwise specified. amb Symbol Parameter L channel series inductance s(ch) C channel capacitance ch I reverse leakage current LR V breakdown voltage BR V forward voltage F R resistance between channels V (ch-ch) R channel series resistance s(ch) [1] Guaranteed by design. Table 5. ...
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... NXP Semiconductors Fig (dB (1) Channel 1 (pin 1 to pin 8) (2) Channel 4 (pin 4 to pin 5) Fig 2. IP3253CZ8 measured insertion loss magnitudes IP3253_54CZ8_CZ12_CZ16_3 Objective data sheet IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network IN 50 TEST BOARD V gen Test board PCB utilizes laser drilled micro-via holes which connect the ground plane to the device ground pins ...
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... NXP Semiconductors (dB (1) Channel 1 (pin 1 to pin 8) (2) Channel 4 (pin 4 to pin 5) Fig 3. IP3254CZ8 measured insertion loss magnitudes IP3253_54CZ8_CZ12_CZ16_3 Objective data sheet IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network 001aal112 (dB ( (MHz) (1) Channel 3 (pin 3 to pin 6) (2) Channel 2 (pin 2 to pin 7) Rev. 03 — ...
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... NXP Semiconductors 7. Package outline HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.75 mm 0.5 0.00 0.15 1 ...
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... NXP Semiconductors HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 2.55 mm 0.5 0.00 0.15 2.45 OUTLINE ...
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... NXP Semiconductors HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3 terminal 1 index area terminal 1 e index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 3.35 mm 0.5 0.00 0.15 3.25 OUTLINE ...
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... NXP Semiconductors 8. Abbreviations Table 6. Acronym DUT EMI ESD LAN PCB PCS QFN RFI RoHS UTLP WAN 9. Revision history Table 7. Revision history Document ID IP3253_54CZ8_CZ12_CZ16_3 Modifications: IP3253CZ8_CZ12_CZ16_2 IP3253CZ8_CZ12_CZ16_1 IP3253_54CZ8_CZ12_CZ16_3 Objective data sheet IP3253/54CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive EMI-filter network Abbreviations ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 12. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Application information 6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Legal information 10.1 Data sheet status ...