TLF14CBH4730R2K1 Taiyo Yuden, TLF14CBH4730R2K1 Datasheet - Page 8

• Manufacturer Part Number: TLF14CBH4730R2K1
• Description: CHOKE COMMON MODE 47000UH
• Manufacturer: Taiyo Yuden
• Series: TLF14CBHr

Specifications of TLF14CBH4730R2K1

• Current: 200mA
• Inductance: 47mH
• Dc Resistance (dcr): 3.6 Ohm Max
• Filter Type: Common Mode - 2 Line Array
• Package / Case: 0.906" L x 0.867" W x 0.690" H (23.00mm x 22.00mm x 17.50mm)
• Mounting Type: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Other names: 587-2829

【Test Method and Remarks】
【Test Method and Remarks】
【Test Method and Remarks】
【Test Method and Remarks】
■
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
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LA Type
CAL45 Type
LHL□□□
FBA/FBR
FL05□ Type
FL06BT Type
LA, CA
LHL□□□・FB ： Directions
LA Type
CAL45 Type
LHL□□□
FBA/FBR
FL05□ Type
FL06BT Type
LA, CA
LA Type
CAL45 Type
LHL□□□
FBA/FBR
FL05□ Type
FL06BT Type
LA, CA
LHL□□□ : Solder temperature : 235±5℃
FB
FL05R□
FL06BT
LA Type
CAL45 Type
LHL□□□
FBA/FBR
FL05□ Type
FL06BT Type
LA, CA
LHL□□□ : Solder bath method
FB
FL
18. Resisitance to vibration
19. Resistance to shock
20. Solderability
21. Resisitance to soldering heat
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
RELIABILITY DATA
Impact material : concrete or vinyl tile
Height : 1m
Total number of drops : 10 times
: Solder temperature : 230±5℃
: Solder temperature : 230±5℃
: Solder temperature : 230±5℃
: Solder temperature : 230±5℃
: Solder temperature
: Solder bath method
: Solder condition
Duration
Immersed conditions : Inserted into substrate with t=1.6mm
Recovery
Manual soldering
Caution
Recovery
Recovery
Immersion depth
Recovery
:
Duration
Duration
Immersion depth
Duration
Immersion depth
Duration
Immersion depth
Duration
Immersion depth
: Directions
Frequency range : 10 to 55 to 10Hz (1min.)
Amplitude
Mounting method : Soldering onto printed board.
Recovery
Frequency range : 10 to 55 to 10Hz (1min.)
Amplitude
Mounting method : Soldering onto printed board.
Drop test
: 2±0.5 sec.
: 2±0.5 sec.
: Up to 1.5mm from bottom of case.
: 3±1 sec.
: Up to 1.5mm from terminal root.
: 2±0.5 sec.
: Up to 2 to 2.5mm from terminal root.
: 3±1 sec.
: Up to 0.5 to 1.0mm from terminal root.
: (CA) 270±5℃, (LA) 260±5℃
: 5±0.5 sec. One time
: At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
: Solder temperature : 260±5℃
: Solder temperature : 350±10℃ (At the tip of soldering iron)
: No excessive pressing shall be applied to terminals.
: 4 to 24hrs of recovery under the standard condition after the test.
: Condition 1 : Solder temperature : 260±5℃
: 3hrs of recovery under the standard condition after the test.
: 260±5℃
: Up to 0.5 to 1.0mm from the terminal root.
: 3hrs of recovery under the standard condition after the test.
: 2 hrs each in X, Y and Z directions total : 6hrs.
: 1.5mm
: At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
: 2 hrs each in X, Y and Z directions total : 6hrs.
: 1.5mm (But don't exceed acceleration 196m/s
Duration
Duration
Condition 2 : Solder temperature : 350±5℃
△L/L : Within ±5% Q : 30min
△L/L : Within ±5%
Appearance : No abnomality
Appearance : No abnomality
No significant abnormality in appearance
At least 75％ of terminal electrode is covered by new solder.
At least 75％ of terminal electrode is covered by new solder.
At least 90％ of terminal electrode is covered by new solder.
At least 75％ of terminal electrode is covered by new solder.
No significant abnormality in appearance
△L/L : Within ±5%
No significant abnormality in appearance
No significant abnormality in appearance
Refer to individual specification
No significant abnormality in appearance
10±1 sec.
Duration
Immersion depth
Duration
Immersion depth
: 10±1 sec.
: 5±1 sec.
Up to 1.5mm from the bottom of case.
Up to 1.5mm from the bottom of case.
: 10±1 sec.
: Up to 1.5mm from the terminal root.
: 3±1 sec.
: Up to 1.5mm from the terminal root.
△L/L : Within ±5%
Impedance change : Within ±20%
2
(two power))
Inductance change : Within ±5%
Impedance change : Within ±20%
Impedance change : Within ±20%
Q change : Within ±30% (LHLP : only △L/L)
1 1
Q change : Within ±30%(LHLP : only △L/L)
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