AUIRF7738L2TR1 International Rectifier, AUIRF7738L2TR1 Datasheet - Page 2

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AUIRF7738L2TR1

Manufacturer Part Number
AUIRF7738L2TR1
Description
MOSFET N-CH 40V 315A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of AUIRF7738L2TR1

Input Capacitance (ciss) @ Vds
7471pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.6 mOhm @ 109A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
315A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
194nC @ 10V
Power - Max
3.3W
Mounting Type
*
Package / Case
*
Continuous Drain Current Id
35A
Drain Source Voltage Vds
40V
On Resistance Rds(on)
0.0012ohm
Rds(on) Test Voltage Vgs
10V
Transistor Case Style
DirectFET L6
No. Of Pins
3
Svhc
No SVHC
Rohs Compliant
Yes
Configuration
Single Hex Drain Hex Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.6 mOhms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
35 A
Power Dissipation
3.3 W
Gate Charge Qg
129 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ƒ Surface mounted on 1 in. square Cu
Notes  through Š are on page 9
V
∆V
R
V
∆V
gfs
R
I
I
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
Static Characteristics @ T
Dynamic Characteristics @ T
Diode Characteristics @ T
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
(still air).
(BR)DSS
GS(th)
SD
DS(on)
G
iss
oss
rss
oss
oss
oss
g
sw
oss
rr
Q
Q
Q
Q
2
(BR)DSS
GS(th)
gs1
gs2
godr
gd
eff.
/∆T
/∆T
J
J
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Forward Transconductance
Gate Resistance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Gate Charge Overdrive
Switch Charge (Q
Output Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Parameter
g
Parameter
Parameter
gs2
J
J
= 25°C (unless otherwise stated)
= 25°C (unless otherwise stated)
+ Q
J
gd
= 25°C (unless otherwise stated)
)
clip heatsink (still air)
Min.
Min.
Min.
–––
–––
–––
113
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
2.0
40
Typ.
Typ.
7471
1640
5936
1465
2261
Typ.
with small
0.02
-8.4
–––
–––
–––
–––
–––
–––
129
737
–––
–––
–––
1.2
3.0
1.0
27
10
45
47
55
54
21
77
39
38
50
68
Max. Units
Max. Units
Max.
-100
–––
–––
–––
–––
–––
250
100
194
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
184
736
102
1.6
4.0
1.3
75
5
mV/°C
Units
V/°C
mΩ
board with metalized back and with small
clip heatsink (still air)
µA
nA
nC
nC
pF
nC
ns
ns
‰ Mounted on minimum footprint full size
V
V
S
A
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
I
See Fig.11
V
V
I
R
V
V
ƒ = 1.0MHz
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
di/dt = 100A/µs
D
D
I
I
S
F
GS
GS
DS
DS
DS
DS
GS
GS
DS
DS
DD
G
GS
DS
GS
GS
GS
= 109A
= 109A
= 109A, V
= 109A, V
= 1.8Ω
= V
= 10V, I
= 40V, V
= 40V, V
= 20V, V
= 16V, V
= 25V
= 0V, I
= 10V, I
= 20V
= -20V
= 20V, V
= 0V
= 0V, V
= 0V, V
= 0V, V
GS
, I
D
D
DS
DS
DS
D
D
= 250µA
GS
DD
GS
GS
GS
GS
GS
Conditions
= 250µA
Conditions
= 109A
= 109A
Conditions
= 1.0V, f=1.0MHz
= 32V, f=1.0MHz
= 0V to 32V
= 0V
= 20V
= 0V
= 0V, T
= 10V
= 0V
= 10V
i
D
i
i
= 1mA
J
www.irf.com
i
= 125°C
G
D
S

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