BUK661R9-40C,118 NXP Semiconductors, BUK661R9-40C,118 Datasheet - Page 4

MOSFET N-CH TRENCH D2PACK

BUK661R9-40C,118

Manufacturer Part Number
BUK661R9-40C,118
Description
MOSFET N-CH TRENCH D2PACK
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet

Specifications of BUK661R9-40C,118

Input Capacitance (ciss) @ Vds
15100pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.9 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
120A
Vgs(th) (max) @ Id
2.8V @ 1mA
Gate Charge (qg) @ Vgs
260nC @ 10V
Power - Max
306W
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (2 leads + Tab), TO-263AB
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.9 mOhms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
120 A
Power Dissipation
306 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free by exemption / RoHS compliant by exemption
NXP Semiconductors
BUK661R9-40C
Product data sheet
Fig 1.
Fig 3.
(A)
I
D
300
200
100
(A)
I
D
10
10
10
10
0
mounting base temperature
Continuous drain current as a function of
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
10
-1
0
4
3
2
1
10
-1
50
(1)
100
150
Limit R
All information provided in this document is subject to legal disclaimers.
T
003aac385
mb
DSon
(°C)
1
200
= V
Rev. 1 — 18 August 2010
DS
/ I
D
Fig 2.
P
(%)
der
120
N-channel TrenchMOS intermediate level FET
80
40
0
function of mounting base temperature
Normalized total power dissipation as a
0
10
DC
50
BUK661R9-40C
100
V
DS
(V)
150
100 μ s
10 ms
100 ms
t
1 ms
p
© NXP B.V. 2010. All rights reserved.
=10 μ s
T
mb
003aae247
03na19
(°C)
200
10
2
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