SESD0201P1BN-0400-090 TE Connectivity, SESD0201P1BN-0400-090 Datasheet - Page 2

TVS DIODE 6V 1CH BI 0201

SESD0201P1BN-0400-090

Manufacturer Part Number
SESD0201P1BN-0400-090
Description
TVS DIODE 6V 1CH BI 0201
Manufacturer
TE Connectivity

Specifications of SESD0201P1BN-0400-090

Mounting Type
Surface Mount
Voltage - Reverse Standoff (typ)
6V
Voltage - Breakdown
9V
Polarization
Bidirectional
Package / Case
0201 (0603 Metric)
Reverse Stand-off Voltage Vrwm
6V
Breakdown Voltage Range
9V To 11V
Diode Configuration
Bidirectional
Diode Case Style
0201
No. Of Pins
2
Msl
MSL 1 - Unlimited
Rohs Compliant
Yes
Product Type
SESD Protector
Breakdown Voltage (min) Vbr @ T
1mA (V)
Working Reverse Voltage (peak) Vrwm (v)
6
Input Capacitance (typ) Vr
0V, f
Leakage Current (max) @ Vrwm
6.0V (µA)
Clamping Voltage (typ) @ Ipp
2A, tp
Halogen Free
Vr≤900ppm, CI≤900ppm, Br+CI ≤1500ppm
Form Factor (mm)
0603
Form Factor (inches)
0201
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Operating Temperature (°c)
-40 – +125
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Other names
SESD0201P1BN-0400-090TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SESD0201P1BN-0400-090
Manufacturer:
TE
Quantity:
40 000
Part Number:
SESD0201P1BN-0400-090
Manufacturer:
SR台湾
Quantity:
20 000
308 Constitution Drive
Menlo Park, CA 94025-1164
Phone: 800-227-4856
www.circuitprotection.com
DEVICE DIMENSIONS
RECOMMENDED LANDING PATTERN:
• Recommended solder thickness: 150 to 200 um
• Recommended rework procedure:
o
o
o
Soldering iron tip temperature should be less than 350
Apply iron tip to solder for less than 5 seconds
Do not apply solder iron tip to the body of this product directly
Typical
mm
mils*
*
Round off approximation
mm
mils*
*
Round off approximation
W
W
0.60 ± 0.05
23.62 ± 2.0
C
C
Overvoltage Protection Device
Silicon ESD Protector
Circuit Protection Products
B
B
A
0.28 ± 0.01
11.0 ± 0.4
D
D
ChipSESD
Pad
Pad
Drawing Not To Scale
L
L
L
0.30 ± 0.05
11.81 ± 2.0
PC Board
PC Board
B
0.19 ± 0.01
7.5 ± 0.4
S
S
A A
A A
S
o
0.30 ± 0.05
11.81 ± 2.0
C
D
D
C
Pad
Pad
PRODUCT: SESD0201P1BN-0400-090
L
L
0.30 ± 0.01
11.8 ± 0.4
W
DOCUMENT: SCD
REV LETTER: A
REV DATE: OCTOBER 25, 2010
PAGE NO.: Page 2 of 5
0.21 ± 0.07
8.27 ± 2.8
D
27763

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