IP4305CX4/LF/P,315 NXP Semiconductors, IP4305CX4/LF/P,315 Datasheet

IP4305CX4/LF/P,315

Manufacturer Part Number

IP4305CX4/LF/P,315

Description

IC ESD PROTECTION

Manufacturer

NXP Semiconductors

Datasheets

1.IP4085CX4LF135.pdf (8 pages)

2.PMEG6010EP115.pdf (61 pages)

3.IP4305CX4LFP315.pdf (7 pages)

Specifications of IP4305CX4/LF/P,315

Product

Schottky Diodes

Configuration

Dual

Forward Voltage Drop

0.25 V, 0.35 V, 0.45 V

Maximum Reverse Leakage Current

1 uA, 8 uA, +/- 50 uA, 80 uA

Maximum Power Dissipation

5 mW

Operating Temperature Range

- 30 C to + 85 C

Mounting Style

SMD/SMT

Package / Case

WLCSP-4

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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1. Product profile

2. Pinning Information

1.1 General description

1.2 Features

1.3 Applications

IP4305CX4/LF (/P) is a dual Schottky diode – one back-2-back diode array in a 2 x 2 pin

CSP with 0.4 mm pitch. In addition to two Schottky diodes with a common Cathode

connection, a integrated bi-directional diode supports the realisation of a high level ESD-

protection. IP4305CX4/LF (/P) is fabricated using monolithic silicon technology and

integrates Schottky and standard silicon Zener diodes in a single Wafer-Level chip-scale

package.These features make the IP4305CX4/LF (/P) ideal for use in applications

requiring component miniaturization, such as mobile phone handsets. For mechanically

demanding applications the option /P as IP4305CX4/LF/P is offering improved

mechanical stability by using advanced solder joints.

General purpose ESD-protection and voltage detection in mobile appliances such as:

Fig 1. Transparent package view,

Cellular and PCS mobile handsets

Wireless data (WAN/LAN) systems

IP4305CX4/LF (/P)

Integrated dual Schottky diode array with ESD protection to

IEC61000-4-2, level 4

20 August 2009

Pb-free, RoHS compliant and free of Halogen and Antimony (dark green compliant)

2 Schottky diodes with common Cathode

One back-to-back diode

Back to back diodes to provide downstream ESD protection up to ±15 kV (contact)

Wafer-Level chip-scale package with 0.4 mm pitch only

balls facing down

Fig 2. IP4305CX4/LF (/P) schematic diagram

Product data sheet

Related parts for IP4305CX4/LF/P,315

IP4305CX4/LF/P,315 Summary of contents

Page 1

IP4305CX4/LF (/P) Integrated dual Schottky diode array with ESD protection to IEC61000-4-2, level 4 20 August 2009 1. Product profile 1.1 General description IP4305CX4/LF (/ dual Schottky diode – one back-2-back diode array ...

Page 2

... NXP Semiconductors 3. Limiting values Table 1. Symbol Parameter V DC input voltage range for A1 to A2 input voltage range for I/O ESD Electrostatic Discharge Pins (B2, A2 connected to an 2kV compliant IC I/O) Pins to B2 with B1 unconnected P Maximum continuous power dissipation D-ch per channel T storage temperature range ...

Page 3

... NXP Semiconductors 5. Design/Assembly Recommendations 5.1 PCB Design Guidelines For the optimum performance, a Non-Solder Mask PCB design (NSMD), also known as a copper- defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer is recommended. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance ...

Page 4

... NXP Semiconductors 6. Package outline Fig 4. IP4305CX4/LF (/P) outline dimensions Product data sheet IP4305CX4/LF (/P) Integrated dual Schottky diode array with ESD protection 0.61 ±0.04 ±0.05 B1 0.26 B2 ±0.05 0.41 ±0.05 ±0.02 Side view Bottom view, balls facing up Pin A1 index area A1 B1 Laser marking area ...

Page 5

... NXP Semiconductors 7. Tape & Reel information OVERALL DIMENSIONS SPROCKET HOLES DISTANCE BETWEEN CENTRE LINES COMPARTMENTS DEVICE CARRIER TAPE ANTISTATIC COVER TAPE BENDING RAD Fig 5. IP4305CX4/LF (/P) Tape & Reel information Product data sheet IP4305CX4/LF (/P) Integrated dual Schottky diode array with ESD protection ...

Page 6

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 7

... NXP Semiconductors 10. Contents 1. Product profile.....................................................1 1.1 General description ............................................1 1.2 Features .............................................................1 1.3 Applications........................................................1 2. Pinning Information ............................................1 3. Limiting values ....................................................2 4. Electrical Characteristics ...................................2 5. Design/Assembly Recommendations ...............3 5.1 PCB Design Guidelines......................................3 5.2 PCB Assembly Guidelines for Pb-free soldering 3 6. Package outline ...................................................4 7. Tape & Reel information .....................................5 8 ...

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