GNM214R71C104MA03D Murata Electronics North America, GNM214R71C104MA03D Datasheet - Page 98
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GNM214R71C104MA03D
Manufacturer Part Number
GNM214R71C104MA03D
Description
CAP 4-ARRAY 0.1UF 16V X7R SMD
Manufacturer
Murata Electronics North America
Datasheet
1.GNM1M2R71C104MA03D.pdf
(220 pages)
Specifications of GNM214R71C104MA03D
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
96
No.
11
12
13
14
15
16
GJM Series Specifications and Test Methods (1)
GJM Series Specifications and Test Methods
Continued from the preceding page.
Vibration
Resistance
Resistance
to Soldering
Heat
Deflection
Solderability of
Termination
Temperature
Cycle
Humidity,
Steady
State
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Q
Appearance
Capacitance
Change
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities
Within the specified tolerance
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
No marking defects
Within T5% or T0.5pF
(Whichever is larger)
75% of the terminations are to be soldered evenly and
continuously.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within T2.5% or T0.25pF
(Whichever is larger)
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
More than 10,000MΩ or 500Ω · F (Whichever is smaller)
No failure
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within T2.5% or T0.25pF
(Whichever is larger)
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
More than 10,000MΩ or 500Ω · F (Whichever is smaller)
No failure
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within T5% or T0.5pF
(Whichever is larger)
30pF and below:
10pF and over, 30pF and below: QU275W
10pF and below:
C: Nominal Capacitance (pF)
More than 10,000MΩ or 500Ω · F (Whichever is smaller)
GJM03
GJM15
Type
Temperature Compensating Type
Specifications
0.3
0.4
a
100
Fig. 2
b
c
a
QU350
QU200W10C
0.9
1.5
b
4.5
5
2
C
t: 0.8mm
0.3
0.5
c
(in mm)
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
Solder the capacitor to the test jig (glass epoxy boards) shown
in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Preheat at 80 to 120D for 10 to 30 seconds. After preheating,
immerse in eutectic solder solution for 2T0.5 seconds at 230T5D
or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5°C.
Preheat the capacitor at 120 to 150D for 1 minute.
Immerse the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu
solder solution at 270T5D for 10T0.5 seconds.
Let sit at room temperature for 24T2 hours.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Let the capacitor sit at 40T2D and 90 to 95% humidity for
500T12 hours.
Remove and let sit for 24T2 hours (temperature compensating
type) at room temperature, then measure.
Temp. (D)
Time (min.)
Step
Min. Operating
Temp.
R230
30T3
1
Capacitance meter
45
W0
Y3
Fig. 3
Test Method
20
Temp.
Room
50
2 to 3
Continued on the following page.
45
Pressurize
2
Pressurizing
speed : 1.0mm/sec.
Max. Operating
Temp.
Flexure : V1
30T3
3
W3
Y0
(in mm)
Temp.
Room
2 to 3
4
C02E.pdf
09.9.18
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