LIS302DL STMicroelectronics, LIS302DL Datasheet - Page 40

Board Mount Accelerometers MEMS motion snsr 3 axis

LIS302DL

Manufacturer Part Number
LIS302DL
Description
Board Mount Accelerometers MEMS motion snsr 3 axis
Manufacturer
STMicroelectronics
Datasheet

Specifications of LIS302DL

Sensing Axis
X, Y, Z
Acceleration
2 g, 8 g
Digital Output - Number Of Bits
8 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.5 V
Supply Current
0.3 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Digital Output - Bus Interface
I2C, SPI
Shutdown
Yes
Sensitivity
18 mg/digit, 72 mg/digit
Package / Case
LGA-14
Output Type
Digital
Acceleration Range
±2g, ±8g
No. Of Axes
3
Interface Type
I2C, SPI
Sensor Case Style
LGA
No. Of Pins
14
Supply Voltage Range
2.16V To 3.6V
Operating Temperature Range
-40°C To +85°C
Svhc
No
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LIS302DL
Manufacturer:
STM
Quantity:
10 500
Part Number:
LIS302DL
Manufacturer:
ST
0
Part Number:
LIS302DL
Manufacturer:
ST
Quantity:
20 000
Part Number:
LIS302DL
Quantity:
648
Part Number:
LIS302DL-MBD
Manufacturer:
ST
0
Part Number:
LIS302DL-MH1
Manufacturer:
ST
0
Part Number:
LIS302DL-SM1
Manufacturer:
ST
0
Part Number:
LIS302DL-TR
Manufacturer:
ST
0
Part Number:
LIS302DLHS0.5
Manufacturer:
INNOLUX
Quantity:
1 000
Part Number:
LIS302DLHTR
Manufacturer:
SANYO
Quantity:
11
Part Number:
LIS302DLTR
Manufacturer:
ST
Quantity:
1 056
Part Number:
LIS302DLTR
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
LIS302DLTR
Quantity:
12 000
Part Number:
LIS302DLTR8
Manufacturer:
SONY
Quantity:
26
Part Number:
LIS302DLTR8
Manufacturer:
ST
Quantity:
20 000
Package information
9
40/42
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 26. LGA 14: mechanical data and package dimensions
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
N
R
e
d
h
k
s
i
0.180
2.850
4.850
0.965
0.640
0.750
0.450
1.200
MIN.
0.920
0.220
3.000
5.000
0.800
0.300
4.000
1.360
1.200
0.975
0.650
0.800
0.500
0.150
0.050
0.100
0.100
TYP.
mm
MAX.
1.000
0.700
0.260 0.0071 0.0087 0.0102
3.150 0.1122 0.1181 0.1240
5.150 0.1909 0.1968 0.2027
0.985 0.0380 0.0384 0.0386
0.660 0.0252 0.0256 0.0260
0.850 0.0295 0.0315 0.0335
0.550 0.0177 0.0197 0.0217
1.600 0.0472
MIN.
0.0362 0.0394
0.0315
0.0118
0.1575
0.0535
0.0472
0.0059
0.0020
0.0039
0.0039
TYP.
inch
0.0275
0.0630
MAX.
LGA14 (3x5x0.92mm) Pitch 0.8mm
Land Grid Array Package
MECHANICAL DATA
OUTLINE AND
7773587 C
LIS302DL

Related parts for LIS302DL