APA300-FGG256 Actel, APA300-FGG256 Datasheet - Page 2

• Manufacturer Part Number: APA300-FGG256
• Description: FPGA - Field Programmable Gate Array 300K System Gates
• Manufacturer: Actel

Specifications of APA300-FGG256

• Processor Series: APA300
• Core: IP Core
• Maximum Operating Frequency: 150 MHz
• Number Of Programmable I/os: 290
• Data Ram Size: 73728
• Supply Voltage (max): 2.7 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: APA-Eval-Kit, APA-Eval-BRD1, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, Flashpro 4, Flashpro 3, Flashpro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 2.3 V
• Number Of Gates: 300 K
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
ii
ProASIC
APA1000
PLUS
Part Number
Flash Family FPGAs
APA1000
APA075 =
APA150 =
APA300
APA450
APA600
APA750
_
=
=
=
=
=
Speed Grade
Blank = Standard Speed
75,000 Equivalent System Gates
150,000 Equivalent System Gates
300,000 Equivalent System Gates
450,000 Equivalent System Gates
600,000 Equivalent System Gates
750,000 Equivalent System Gates
1,000,000 Equivalent System Gates
FG
Package Type
TQ = Thin Quad Flat Pack (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
BG = Plastic Ball Grid Array (1.27 mm pitch)
CQ = Ceramic Quad Flat Pack (1.05 mm pitch)
CG = Ceramic Column Grid Array (1.27 mm pitch)
LG = Land Grid Array (1.27 mm pitch)
G
Lead-free packaging
Blank = Standard Packaging
1152
G = RoHS Compliant Packaging
Package Lead Count
v5.9
I
Application (Ambient Temperature Range)
Blank = Commercial (0°C to +70°C)
PP = Pre-production
ES = Engineering Silicon (room temperature only)
M = Military (–55°C to 125°C)
B = MIL-STD-883 Class B
I = Industrial (–40°C to +85°C)