IXDD604D2TR Clare, IXDD604D2TR Datasheet - Page 13

• Manufacturer Part Number: IXDD604D2TR
• Description: MOSFET & Power Driver ICs 4A Dual Low-Side Ultrafast Mosfet DRV
• Manufacturer: Clare
• Type: Dual Low-Side Ultrafast MOSFET Driversr

Specifications of IXDD604D2TR

• Product: MOSFET Gate Drivers
• Rise Time: 9 ns
• Fall Time: 8 ns
• Propagation Delay Time: 29 ns
• Supply Voltage (max): 35 V
• Supply Voltage (min): 4.5 V
• Supply Current: 10 uA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Output Current: 4 A
• Package / Case: DFN-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
R02
Embossed Carrier
5.4.5 D2 (8-
5.4.6 Tape & Reel Information for D2 Package
(0.014 / 0.018 x 45º)
(0.037 BSC)
0.95 BSC
0.35 / 0.45 x 45º
(0.158 BSC)
4.00 BSC
Pin
(13.00 DIA.)
330.2 DIA.
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
DFN)
Pin 1
Pin 1
Embossment
(0.030 / 0.032)
(0.197 BSC)
0.76 / 0.81
5.00 BSC
B
0
=5.40 ± 0.10
5º MAX
(0.100 / 0.102)
2.54 / 2.59
K
0
=1.90 ± 0.10
Pin 8
R0.75 TYP
(0.012 / 0.018)
0.30 / 0.45
(0.031 / 0.039)
0.80 / 1.00
(0.000 / 0.002)
0.30 ± 0.05
www.clare.com
(0.120 / 0.122)
0.00 / 0.05
3.04 / 3.09
5º MAX
4.00 ± 0.10 See Note #2
NOTE:
The exposed metal pad on the back of the D2 package may be
left floating or connected to ground. It is not suitable for carrying current.
(0.008 REF)
2.00 ± 0.05
0.20 REF
A
0
=4.25 ± 0.10
(0.018)
0.45
(0.037)
Recommended PCB Land Pattern
0.95
(0.047)
1.20
8.00 ± 0.10
(0.014 x 45º)
NOTES:
1. A
2. 10 pitches cumulative tol. ± 0.2mm
3. ( ) Reference dimensions only.
4. Unless otherwise specified, all dimensions in millimeters.
0.35 x 45º
(0.05)
0
& B
Specification: DS-IXD_604-R02
©Copyright 2010, Clare, Inc.
All rights reserved. Printed in USA.
12/3/2010
∅1.55 ± 0.05
0
measured at 0.3mm above base of pocket.
(0.05)
(0.177)
(0.100)
(inches MIN / inches MAX)
4.50
2.55
mm MIN / mm MAX
Dimensions
1.75 ± 0.10
∅1.50 (MIN)
(0.120)
5.50 ± 0.05
3.05
IXD_604
12.00 ± 0.30
13