PCA9507D,118 NXP Semiconductors, PCA9507D,118 Datasheet - Page 17

• Manufacturer Part Number: PCA9507D,118
• Description: I/O Expanders, Repeaters & Hubs LEVEL TRANSL I2C BUS
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PCA9507D,118

• Logic Family: SDA, SCL
• Propagation Delay Time: 218 ns
• Operating Supply Voltage: 2.7 V to 5.5 V
• Power Dissipation: 100 mW
• Operating Temperature Range: - 40 C to + 85 C
• Logic Type: I2C Bus
• Mounting Style: SMD/SMT
• Output Current: 50 mA
• Output Voltage: 0.52 V
• Package / Case: SO-8
• Mounting Type: Surface Mount
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Interface: I²C, SMBus
• Number Of I /o: 24
• Frequency - Clock: 400kHz
• Interrupt Output: No
• Includes: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935285823118 PCA9507D-T

NXP Semiconductors
PCA9507_1
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
19.
Rev. 01 — 7 February 2008
2-wire serial bus extender for HDMI DDC I
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
19) than a SnPb process, thus
220
220
350
> 2000
260
245
245
2
PCA9507
C-bus and SMBus
© NXP B.V. 2008. All rights reserved.
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