IES5501T Hendon Semiconductors, IES5501T Datasheet
IES5501T
Specifications of IES5501T
Related parts for IES5501T
IES5501T Summary of contents
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... GND Fig.1 Block diagram 2 ( trademark of NXP Semiconductors © 2008 Hendon Semiconductors Pty. Ltd. , all rights reserved. 2008 Jun 13, Revision 1.4 Fast Dual Bi-Directional Bus Buffer 3 GENERAL DESCRIPTION The IES5501 is a monolithic bipolar integrated circuit for bus buffering in applications including I PMbus, and other systems based on similar principles. ...
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PINNING INFORMATION 5.1 Pinning layout IES5501 GND Fig.2 Pinning diagram (SO8 / MSOP8) 6 FUNCTIONAL DESCRIPTION 6 GND - DC supply pins CC The power supply voltage for ...
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LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are specified with respect to pin 4 (GND) SYMBOL PARAMETER V Supply voltage range ( Voltage range ( Sxx A1 V Voltage ...
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V Sxx 70% V Sx2 33%V cc 30% V Sx2 td tf Fig.3 Timing Parameters 5.5 5 4.5 4.0 3.5 3.0 2.5 - Temperature (°C) Fig.5 Supply Current vs Temperature Fig.7 Rise time 2008 ...
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APPLICATION INFORMATION 9.1 Design Considerations Figure 9 shows the IES5501 level shifting signals from 1.8V to 3.3V at 1MHz clock speed. The IES5501 has excellent application to extending loads and providing interfaces to connectors on high speed microprocessor cards, ...
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Application circuits 1. 600 600 V CC SCL SDA Bus Master 400kHz U1 Fully-Bused Compliant Plug-in (Hot-Insert) ShMC Module (eg. AMC RRA* µP IES5502 Vin Vol=Vin+0.08 * RRA = Rise Rate Accelerator R ALTERNATE IMPLEMENTATIONS ...
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R1 R2 1.1k 1.1k SCL SDA Isolated I C Bus IES5501 provides bus isolation and simplifies calculation of bus RC components Fig.12 IES5501 isolating the standard 1.5k 1. SCL SDA Bus Master U1 Alternately, ...
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74LS137 De-multiplexer Fig.14 IES5501 bus multiplexer application driven from a simple logic device SCL SDA Fig.15 IES5501 bus multiplexer application driven from an I2C I/O Expander 2008 Jun 13, Revision 1.4 Fast Dual ...
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... ORDERING INFORMATION TYPE NUMBER NAME IES5501T SO8 plastic small outline package; 8 leads; body width 3.9 mm IES5501D MSOP-8L micro small outline package; 8 leads; body width 3.0 mm Other package options are available - contact Hendon Semiconductors for details. For more information on packages, please refer to the document “Integrated Circuit Packaging and Soldering Information” on the Hendon Semiconductors web site ...
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... Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given advisory and does not form part of the specification. 14 COMPANY INFORMATION HENDON SEMICONDUCTORS PTY. LTD. ABN 17 080 879 616 Postal address: Hendon Semiconductors PO Box 2226 ...
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... DISCLAIMER Hendon Semiconductors Pty. Ltd. ABN 17 080 879 616 (“Hendon”) reserves the right to make changes to both its products and product data without notice. Hendon makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Hendon assume any liability arising out of the use or application of any Hendon product. Hendon specifically disclaims any and all liability, including without limitation incidental or consequential damages ...