73S8024RN-IM/F Maxim Integrated Products, 73S8024RN-IM/F Datasheet - Page 27

• Manufacturer Part Number: 73S8024RN-IM/F
• Description: I/O Controller Interface IC ISO 7816 Electrical Interface IC
• Manufacturer: Maxim Integrated Products

Specifications of 73S8024RN-IM/F

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DS_8024RN_020
Revision History
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Rev. 1.9
Revision
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618
Date
5/18/2004
11/5/2004
4/27/2005
7/15/2005
8/23/2005
12/5/2007
1/17/2008
1/19/2009
5/27/2010
TEL [phone], FAX [phone], http://www.Teridian.com
Description
First publication.
Added 20QFN package option and ordering information. Updated 32 QFN
ordering information.
Removes leaded package options, replaces 32QFN punched with SAWN
mechanical dimensions, update 28SO package dimensions.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
In
Also, changed the pin description.
In
Added the NDS logo to
Added the Related Documentation and the Contact Information sections.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
Figure
Figure
1, modified the device block diagram to make pin 2 a no connect.
9, changed the mechanical drawing for the 20QFN package.
page 1
and assigned document number.
73S8024RN Data Sheet
27