SI4840BDY-T1-E3 Vishay, SI4840BDY-T1-E3 Datasheet - Page 2

MOSFET Power 40V 19A 6.0W 9.0mohm @ 10V

SI4840BDY-T1-E3

Manufacturer Part Number
SI4840BDY-T1-E3
Description
MOSFET Power 40V 19A 6.0W 9.0mohm @ 10V
Manufacturer
Vishay
Datasheet

Specifications of SI4840BDY-T1-E3

Transistor Polarity
N-Channel
Minimum Operating Temperature
- 55 C
Configuration
Single Quad Drain Triple Source
Resistance Drain-source Rds (on)
0.009 Ohm @ 10 V
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
12.4 A
Power Dissipation
2500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOIC-8 Narrow
Continuous Drain Current Id
19A
Drain Source Voltage Vds
40V
On Resistance Rds(on)
9mohm
Rds(on) Test Voltage Vgs
10V
Voltage Vgs Max
20V
Operating Temperature Range
-55°C To
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI4840BDY-T1-E3
Manufacturer:
TI
Quantity:
4 492
Part Number:
SI4840BDY-T1-E3
Manufacturer:
VISHAY
Quantity:
5 000
Part Number:
SI4840BDY-T1-E3
Manufacturer:
VISHAY
Quantity:
760
Part Number:
SI4840BDY-T1-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Si4840BDY
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
SPECIFICATIONS T
Parameter
Static
Drain-Source Breakdown Voltage
V
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
DS
GS(th)
Temperature Coefficient
Temperature Coefficient
b
a
a
J
= 25 °C, unless otherwise noted
a
ΔV
Symbol
R
ΔV
V
GS(th)
I
t
t
t
t
I
I
C
V
GS(th)
D(on)
DS(on)
C
V
C
Q
Q
d(on)
d(off)
d(on)
d(off)
I
GSS
DSS
Q
g
Q
R
SM
I
t
t
t
DS
t
t
DS
oss
t
t
SD
iss
rss
S
rr
gd
a
b
fs
gs
r
f
r
f
g
g
rr
/T
/T
J
J
I
F
V
V
V
I
V
= 10 A, dI/dt = 100 A/µs, T
DS
I
DS
D
D
DS
DS
≅ 10 A, V
≅ 10 A, V
= 10 V, V
= 10 V, V
= 40 V, V
V
V
V
= 20 V, V
V
V
V
V
V
DS
DS
GS
V
V
GS
DS
I
GS
DS
DS
S
DD
DD
Test Conditions
= 10 A, V
= 0 V, V
= V
= 4.5 V, I
= 15 V, I
= 10 V, I
= 0 V, I
= 40 V, V
≥ 5 V, V
= 20 V, R
= 20 V, R
T
I
f = 1 MHz
GEN
D
GEN
GS
C
GS
GS
GS
= 250 µA
GS
= 25 °C
= 4.5 V, I
, I
= 10 V, I
= 4.5 V, R
= 0 V, T
D
= 10 V, R
GS
= 0 V, f = 1 MHz
D
GS
D
D
D
GS
= 250 µA
GS
= 250 µA
= 12.4 A
= 12.4 A
= ± 20 V
= 10.8 A
L
L
= 10 V
= 0 V
= 2 Ω
= 2 Ω
= 0 V
D
J
D
= 55 °C
= 12.4 A
g
= 12.4 A
g
J
= 1 Ω
= 25 °C
= 1 Ω
Min.
40
50
1
0.0074
0.0095
S09-0532-Rev. C, 06-Apr-09
2000
Typ.
17.5
12.5
260
150
6.7
5.1
1.4
0.8
- 6
56
33
15
25
12
25
10
10
15
30
10
30
26
40
Document Number: 69795
± 100
0.009
0.012
Max.
2.1
1.2
50
23
40
20
40
15
15
25
45
15
30
50
60
52
3
1
5
mV/°C
Unit
nA
µA
pF
nC
nC
ns
ns
ns
Ω
Ω
V
V
A
S
A
V

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