ES3D Taiwan Semiconductor, ES3D Datasheet
ES3D
Manufacturer Part Number
ES3D
Description
Rectifiers 3A 200V
Manufacturer
Taiwan Semiconductor
Datasheet
1.ES3G.pdf
(2 pages)
Specifications of ES3D
Product
Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
200 V
Forward Voltage Drop
0.95 V
Recovery Time
35 ns
Forward Continuous Current
3 A
Max Surge Current
100 A
Reverse Current Ir
10 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Package / Case
SMC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
R6
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ES3D
Manufacturer:
台半
Quantity:
20 000
Company:
Part Number:
ES3D-13-02-F
Manufacturer:
VISHAY
Quantity:
7 122
Company:
Part Number:
ES3D-13-F
Manufacturer:
DIODES
Quantity:
3 000
Part Number:
ES3D-13-F
Manufacturer:
DIODES/美台
Quantity:
20 000
Company:
Part Number:
ES3D-E3/57T
Manufacturer:
VISHAY
Quantity:
12 000
Company:
Part Number:
ES3D-E3/57T
Manufacturer:
DIDES
Quantity:
3 122
Part Number:
ES3D-E3/57T
Manufacturer:
VISHAY/威世
Quantity:
20 000
Features
Mechanical Data
Maximum Ratings and Electrical Characteristics
Rating at 25
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig. 1
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method ) @T
Maximum Instantaneous Forward Voltage
@ 3.0A
Maximum DC Reverse Current @ T
at Rated DC Blocking Voltage @ T
Maximum Reverse Recovery Time ( Note 1 )
Typical Junction Capacitance ( Note 2 )
Typical Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
Type Number
Laboratory Classification 94V-0
Glass passivated junction chip
For surface mounted applications
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Super fast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:
260
Plastic material used carries Underwriters
Cases: Molded plastic
Terminals: Pure tin plated, lead free.
Polarity: Indicated by cathode band
Packaging: 16mm tape per EIA STD RS-481
Weight: 0.21 gram
o
C/10 seconds at terminals
1. Reverse Recovery Test Conditions: I
2. Measured at 1 MHz and Applied V
3. Units Mounted on P.C.B. with 0.6” x 0.6”(16mm x 16mm) Copper Pad Areas
o
C ambient temperature unless otherwise specified.
L
= 100
A
o
=100
A
C
=25
o
o
C
C
3.0 AMPS. Surface Mount Super Fast Rectifiers
Symbol
V
V
I
R
R
I
R
T
V
FSM
(AV)
Trr
V
RRM
RMS
Cj
=4.0 Volts
I
T
STG
θJA
DC
θJL
R
F
F
J
=0.5A, I
- 184 -
ES
3A
50
35
50
R
=1.0A, I
100 150 200 300 400 500 600
100 150 200 300 400 500 600
ES
3B
70
0.95
Dimensions in inches and (millimeters)
45
RR
.063(1.6)
.039(1.0)
105 140 210 280 350 420
.103(2.62)
.079(2.00)
.126(3.20)
.114(2.90)
ES
3C
=0.25A
-55 to +150
-55 to +150
SMC/DO-214AB
ES
3D
100
500
3.0
10
35
47
12
ES
3F
1.3
ES3A - ES3J
.280(7.11)
.260(6.60)
.320(8.13)
.305(7.75)
ES
3G
30
.008(.20)
.004(.10)
ES
3H
.012(.31)
.006(.15)
1.7
.061(1.56)
.050(1.26)
ES
.245(6.22)
.220(5.59)
3J
Version: B07
o
Units
C
uA
uA
nS
pF
o
o
V
V
V
A
A
V
C
C
/W
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ES3D Summary of contents
Page 1
Features Glass passivated junction chip For surface mounted applications Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Super fast recovery time for high efficiency Glass passivated chip junction High temperature soldering: o 260 C/10 ...
Page 2
RATINGS AND CHARACTERISTIC CURVES (ES3A THRU ES3J) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE P.C.B. MOUNTED ON 0.6X0.6"(16X16mm) COPPER PADS 100 110 120 o LEAD TEMPERATURE FIG.3- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 100 0 ...