4313-T-B1_B_ANY Silicon Laboratories Inc, 4313-T-B1_B_ANY Datasheet - Page 47

• Manufacturer Part Number: 4313-T-B1_B_ANY
• Description: WiFi / 802.11 Modules & Development Tools WiFi/802.11 Modules & Development Tools
• Manufacturer: Silicon Laboratories Inc

Specifications of 4313-T-B1_B_ANY

• Wireless Frequency: 315 MHz to 915 MHz
• Modulation: FSK, OOK
• For Use With/related Products: Si4313
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for the
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for small body components.
Symbol
C1
C2
X1
X2
Y1
Y2
E
Table 18. PCB Land Pattern Dimensions
Rev. 1.0
3.90
3.90
0.20
2.65
0.65
2.65
Min
Millimeters
0.50 REF
Max
4.00
4.00
0.30
2.75
0.75
2.75
Si4313-B1
47