TE-POWER-PLUS Micropelt, TE-POWER-PLUS Datasheet - Page 2

Power Management Modules & Development Tools SM THERMAL ENERGY HARVESTING DEV KIT

TE-POWER-PLUS

Manufacturer Part Number
TE-POWER-PLUS
Description
Power Management Modules & Development Tools SM THERMAL ENERGY HARVESTING DEV KIT
Manufacturer
Micropelt
Type
Energy Harvestingr
Datasheet

Specifications of TE-POWER-PLUS

Input Voltage
0.27 V to 2 V
Output Voltage
1.6 V to 5 V
Board Size
63 mm x 30 mm x 34 mm
Maximum Operating Temperature
+ 105 C
Product
Power Management Modules
Dimensions
63 mm x 30 mm x 34 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TE-POWER-PLUS
Manufacturer:
Micropelt
Quantity:
135
1. Technology Principles - Milliwatt Energy from Waste Heat
Thermoelectric (TE) power generation is based on the
‘Seebeck-Effect’ describing the generation of a voltage
from a heat flux through one or more TE leg pairs
(thermocouples) each composed of p-type and n-type
thermoelectric semiconductor materials. Micropelt uses
compounds of Bismuth (Bi), Antimony (Sb), Tellurium
(Te) and Selenium (Se) because of their useful perfor-
mance at operating temperatures from below room
temperature up to 200 °C.
The output voltage generated is proportional to the
number of thermocouples, the applied temperature
gradient ∆T across the generator element, and a
constant α which describes the material properties.
U = N
U is not dependent on the size of the thermocouple!
This simply means: More thermocouples, regardless of
size, the higher the output voltage from a given
gradient! Our patented MEMS-like thin film micro-
structuring process produces thermogenerators with
the world’s highest feature density of up to 100
thermocouples per mm². This enables a 400 times
higher output voltage compared to conventional TE
devices.
www.micropelt.com | phone +49 761 156 337 0 | info@micropelt.com
legpairs
p contact
× ∆T × α
Silicon Substrate
n contact
Cold Side
Area for Thermal Coupling
( 3388 µm x 3364 µm )
Hot Side
Area for Thermal Coupling
( 4248 µm x 3364 µm )
7 0 0
µ m
N Legs
Bi
Compounds
4 2 4
3 3 8
2
8 µ
Te
8 µ
m
3
m
Based
Wafer-based production ensures easy volume
scalability and attractive economies of scale, making
this technology a preferable option for high volume
self-powered applications.
Still there are the intricacies of designing an efficient
thermal path in order to make the best out of the given
temperature gradients found in harvesting target
locations. The fourth generation of thermal path design
is implemented in the TE-Power BASE which serves as
primary power source in all systems of the family. A
single thermogenerator MPG-D751 generates the
power.
P Legs
Bi
Compounds
2
Te
525 µm
525 µm
TE-Power ONE is targeted for primary TEG power
and thermal path evaluation, with direct power and
temperature sensor output interface.
TE-Power PLUS is the fixed voltage source for
applications which already contain duty cycle
oriented power management. Energy is buffered in a
capacitor which can be customer-extended via a
solder terminal connected in parallel. For best
efficacy matched load operation is recommended.
3
Based
MPG-D751 thermoelectric generator chip
mounted on Al heat collector along with
digital and analog temperature sensors.
0037DSTPP75x0310v5e |
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