APDS-9120-020 Avago Technologies US Inc., APDS-9120-020 Datasheet - Page 15

• Manufacturer Part Number: APDS-9120-020
• Description: Photodiodes Proximity Sensor
• Manufacturer: Avago Technologies US Inc.
• Type: Integrated Optical Proximity Sensorr
• Series: -r

Specifications of APDS-9120-020

• Maximum Light Current: 500 mA
• Maximum Rise Time: 1 us
• Maximum Fall Time: 1 us
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Product: Integrated Ambient Light and Proximity Sensor
• Proximity Sensor Type: Optical
• Proximity Sensor Sensing Distance: 30mm
• Proximity Sensor Sensing Distance Range: 15 to 50mm
• Mounting: Surface Mount
• Package Type: SMD
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Sensing Distance: 1.181" (30mm)
• Sensor Type: Optical
• Sensing Object: Non-Metallic
• Response Frequency: -
• Material - Body: -
• Shielding: Unshielded
• Voltage - Supply: 2.4 V ~ 3.6 V
• Output Type: Analog, Digital
• Terminal Type: -
• Package / Case: 10-SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

For product information and a complete list of distributors, please go to our web site:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1937EN - March 24, 2010
Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different 'T/'time tem-
perature change rates or duration. The 'T/'time rates
or duration are detailed in the above table. The tempera-
tures are measured at the component to printed circuit
board connections.
In process zone P1, the PC board and component pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of
both the PC board and component pins.
Process zone P2 should be of sufficient time duration (100 to
180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reflow zone. In zone P3, the tem-
200
120
255
230
217
180
150
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point, 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
HEAT
R1
P1
UP
50
R2
SOLDER PASTE DRY
100
P2
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
150
www.avagotech.com
perature is quickly raised above the liquidus point of solder
to 260°C (500°F) for optimum results. The dwell time above
the liquidus point of solder should be between 60 and 90
seconds. This is to assure proper coalescing of the solder
paste into liquid solder and the formation of good solder
connections. Beyond the recommended dwell time the in-
termetallic growth within the solder connections becomes
excessive, resulting in the formation of weak and unreli-
able connections. The temperature is then rapidly reduced
to a point below the solidus temperature of the solder to
allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The cool
down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting
minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
'T
25°C to 150°C
150°C to 200°C
200°C to 260°C
260°C to 200°C
200°C to 25°C
> 217°C
260°C
–
25°C to 260°C
R3
60 sec to 90 sec
Above 217 C
MAX 260C
200
REFLOW
SOLDER
P3
R4
COOL DOWN
250
Maximum 'T/'time
or Duration
3°C/s
100s to 180s
3°C/s
-6°C/s
-6°C/s
60s to 120s
–
20s to 40s
8mins
P4
R5
(SECONDS)
t-TIME
300