TSL2550D TAOS, TSL2550D Datasheet - Page 18

• Manufacturer Part Number: TSL2550D
• Description: Industrial Optical Sensors Ambient Light Sensor SMBus
• Manufacturer: TAOS
• Type: Ambient Light Sensor with Digital Outputr

Specifications of TSL2550D

• Product: Ambient Light Sensor
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TSL2550D-TR

TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L − OCTOBER 2007
Moisture Sensitivity
Package D
Package T
18
Copyright E 2007, TAOS Inc.
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound.
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all
devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further
action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken
on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each
device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope
with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.
The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours.
Temperature Range
Relative Humidity
Total Time
Opened Time
60% maximum
6 months from the date code on the aluminized envelope — if unopened
5°C to 50°C
168 hours or fewer
MANUFACTURING INFORMATION
r
www.taosinc.com
r
The LUMENOLOGY r Company